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Soonwan Chung
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Journal Articles

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031010.
https://doi.org/10.1115/1.4007118
Published Online: July 23, 2012
View Article titled, Effect of Shield-Can on Dynamic Response of Board-Level Assembly
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Topics: Deformation, Dynamic response, Failure, Finite element model, Shapes, Solder joints, Stress, Displacement, Stress analysis (Engineering), Manufacturing
Proceedings Papers

Effect of Shield-Can Design on Dynamic Responses of PCB Under Board Level Drop Impact

Da Yu, Jae B. Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 305-310, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-12639
https://doi.org/10.1115/IMECE2009-12639
View Paper titled, Effect of Shield-Can Design on Dynamic Responses of PCB Under Board Level Drop Impact
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Topics: Design, Dynamic response, Deformation, Shapes, Simulation, Boundary-value problems, Electrons, Failure, Finite element analysis, Instrumentation
Proceedings Papers

Effect of Board-Level Reflow on Adhesion Between Lead-Free Solder and Underfill in Flip-Chip BGA Packages

Zhenming Tang, Seungbae Park, H. C. John Lee, Soonwan Chung
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 9-14, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43159
https://doi.org/10.1115/IMECE2007-43159
View Paper titled, Effect of Board-Level Reflow on Adhesion Between Lead-Free Solder and Underfill in Flip-Chip BGA Packages
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Topics: Adhesion, Ball-Grid-Array packages, Flip-chip, Lead-free solders, Fatigue life, Solders, Cycles, Cavities, Delamination, Failure
Journal Articles

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

S. B. Park, Chirag Shah, Jae B. Kwak, Changsoo Jang, Soonwan Chung, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
https://doi.org/10.1115/1.3000097
Published Online: November 17, 2008
View Article titled, Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
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Topics: Accelerometers, Deformation, Dynamic response, Printed circuit boards, Strain gages, Transients (Dynamics), Lumber, Displacement
Journal Articles

Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling

S. B. Park, Rahul Joshi, Izhar Ahmed, Soonwan Chung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041004.
https://doi.org/10.1115/1.2993146
Published Online: November 17, 2008
View Article titled, Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling
Open the PDF for Comparative Studies on Solder Joint Reliability of Plastic and Ceramic Ball Grid Array Packages of the Same Form Factor Under Power and Accelerated Thermal Cycling in another window
Topics: Ball-Grid-Array packages, Ceramics, Computational fluid dynamics, Deformation, Finite element analysis, Flip-chip devices, Interferometry, Manufacturing, Reliability, Solder joints
Proceedings Papers

Structural Reliability of SU-8 Material for MEMS Application

S. B. Park, Soonwan Chung, Sandeep Makhar, Harold Ackler, Pinyen Lin
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 251-258, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-82647
https://doi.org/10.1115/IMECE2005-82647
View Paper titled, Structural Reliability of SU-8 Material for MEMS Application
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Topics: Bone, Computer simulation, Deflection, Elastic moduli, Failure analysis, Fatigue, Finite element analysis, Fracture toughness, Mechanical properties, Membranes
Proceedings Papers

Viscoelastic Material Properties of SU-8 and Carbon-Nanotube-Reinforced SU-8 Materials

Seungbae Park, Soonwan Chung, Harold Ackler, Sandeep Makhar
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 43-52, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-16062
https://doi.org/10.1115/IMECE2006-16062
View Paper titled, Viscoelastic Material Properties of SU-8 and Carbon-Nanotube-Reinforced SU-8 Materials
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Topics: Carbon, Nanotubes, Viscoelastic materials, Temperature, Carbon nanotubes, Composite materials, Polymers, Creep, Microelectromechanical systems, Microfabrication