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Sandeep Tonapi
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Proceedings Papers

Design for Reliability of Stacked Die Package Using TSV Technology

Shiwani Thakur, Satej Nakanekar, Abhijit Kaisare, Sandeep Tonapi
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 75-82, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52264
https://doi.org/10.1115/IPACK2011-52264
View Paper titled, Design for Reliability of Stacked Die Package Using TSV Technology
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Topics: Design, Reliability
Proceedings Papers

A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages

Saketh Mahalingam, Sandeep Tonapi, Suresh K. Sitaraman
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1341-1346, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73493
https://doi.org/10.1115/IPACK2005-73493
View Paper titled, A Fracture Mechanics Analysis of Underfill Delamination in Flip Chip Packages
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Topics: Delamination, Flip-chip packages, Fracture mechanics, Fatigue, Flip-chip, Flip-chip devices, Solders, Adhesives, Computer simulation, Displacement
Proceedings Papers

Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

Arun Gowda, Annita Zhong, Sandeep Tonapi, Kaustubh Nagarkar, K. Srihari
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1911-1918, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73490
https://doi.org/10.1115/IPACK2005-73490
View Paper titled, Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities
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Topics: Mechanical properties, Silicones, Heat, Adhesives, Fillers (Materials), Flat heat pipes, Microelectronic devices, Phase change materials, Pumps, Resins
Journal Articles

Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials

Saketh Mahalingam, Ananth Prabhakumar, Sandeep Tonapi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041005.
https://doi.org/10.1115/1.3010378
Published Online: November 17, 2008
View Article titled, Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials
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Topics: Delamination, Flip-chip assemblies, Flow (Dynamics), Thermal shock, Fracture (Materials), Thermomechanics, Fatigue
Proceedings Papers

The Characterization of Underfill-Passivation Interface Under Monotonic and Fatigue Loading and Its Application to Flip Chip Reliability Prediction

Saketh Mahalingam, Sandeep Tonapi, Suresh K. Sitaraman
Proc. ASME. IMECE2005, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 219-224, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-83029
https://doi.org/10.1115/IMECE2005-83029
View Paper titled, The Characterization of Underfill-Passivation Interface Under Monotonic and Fatigue Loading and Its Application to Flip Chip Reliability Prediction
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Topics: Fatigue, Flip-chip, Flip-chip devices, Reliability, Delamination, Flip-chip packages, Solder joints, Computer simulation, Failure, Flow (Dynamics)
Proceedings Papers

Development of No Flow Underfills for Lead-Free Flip Chip Applications

Kaustubh Nagarkar, Tan Zhang, David Esler, David Simon, Paul Gillespie, Sandeep Tonapi, Prameela Susarla, Ryan Mills
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 67-72, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-13420
https://doi.org/10.1115/IMECE2006-13420
View Paper titled, Development of No Flow Underfills for Lead-Free Flip Chip Applications
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Topics: Flip-chip devices, Flow (Dynamics), Manufacturing, Packaging, Flip-chip, Electronic packaging, Electronics, Flip-chip assemblies, High temperature, Lead-free solders
Journal Articles

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

Saketh Mahalingam, Kunal Goray, Sandeep Tonapi, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 405–411.
https://doi.org/10.1115/1.2386242
Published Online: October 4, 2006
View Article titled, Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials
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Topics: Delamination, Fatigue, Fatigue testing, Fracture (Materials), Stress, Thermomechanics, Temperature, Experimental characterization, Fracture (Process), Fracture toughness
Journal Articles

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
https://doi.org/10.1115/1.2188952
Published Online: February 14, 2006
View Article titled, Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems
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Topics: Acoustics, Adhesives, Aluminum, Computerized tomography, Contact resistance, Fillers (Materials), Magnification, Microscopy, Scanning electron microscopy, Silicon
Journal Articles

Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials

Slawomir Rubinsztajn, Donald Buckley, John Campbell, David Esler, Eric Fiveland, Ananth Prabhakumar, Donna Sherman, Sandeep Tonapi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 77–85.
https://doi.org/10.1115/1.1846067
Published Online: June 3, 2005
View Article titled, Development of Novel Filler Technology for No-Flow and Wafer Level Underfill Materials
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Topics: Fillers (Materials), Flip-chip devices, Flow (Dynamics), Reliability, Resins, Semiconductor wafers, Flip-chip, Thermal expansion, Epoxy resins, Solder joints