1-20 of 41
Samuel Graham
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Phase Change Material for Thermal Energy Storage in Buildings Based on Sodium Sulfate Decahydrate and Disodium Hydrogen Phosphate Dodecahydrate

Tugba Turnaoglu, Navin Kumar, Jason Hirschey, Yuzhan Li, Damilola O. Akamo, Tim J. LaClair, Orlando Rios, Kyle R. Gluesenkamp, Samuel Graham
Proc. ASME. ES2023, ASME 2023 17th International Conference on Energy Sustainability, V001T03A004, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: ES2023-106796
https://doi.org/10.1115/ES2023-106796
View Paper titled, Phase Change Material for Thermal Energy Storage in Buildings Based on Sodium Sulfate Decahydrate and Disodium Hydrogen Phosphate Dodecahydrate
Open the PDF for Phase Change Material for Thermal Energy Storage in Buildings Based on Sodium Sulfate Decahydrate and Disodium Hydrogen Phosphate Dodecahydrate in another window
Topics: Energy storage, Hydrogen, Phase change materials, Sodium, Structures, Thermal energy storage
Proceedings Papers

Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces

Jingjing Shi, Anusha Krishnan, A. F. M. Anhar Uddin Bhuiyan, Yee Rui Koh, Kenny Huynh, Akhil Mauze, Sai Mu, Brian M. Foley, Habib Ahmad, Takeki Itoh, Yuewei Zhang, Chao Yuan, Samuel Kim, W. Alan Doolittle, Chris Van de Walle, James S. Speck, Mark Goorsky, Patrick Hopkins, Hongping Zhao, Samuel Graham
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A005, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74116
https://doi.org/10.1115/IPACK2021-74116
View Paper titled, Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces
Open the PDF for Thermal Transport Across Al-(Al x Ga 1-x ) 2 O 3 and Al-Ga 2 O 3 Interfaces in another window
Topics: Alloys, Aluminum, Cathode rays, Chemical reactions, Cooling, Electrical conductance, Electron beams, Electronics, Energy dissipation, Gallium
Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Article titled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Open the PDF for Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging in another window
Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs

Robert Pearson, Bikramjit Chatterjee, Samuel Kim, Samuel Graham, Alexander Rattner, Sukwon Choi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021012.
Paper No: EP-19-1087
https://doi.org/10.1115/1.4046620
Published Online: April 6, 2020
View Article titled, Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs
Open the PDF for Guidelines for Reduced-Order Thermal Modeling of Multifinger GaN HEMTs in another window
Topics: Gallium nitride, Gates (Closures), Heat, Modeling, Temperature, Heat flux, Heating, Critical heat flux, Heart failure, Approximation
Proceedings Papers

Electrothermal Modeling and Analysis of Gallium Oxide Power Switching Devices

Ramchandra M. Kotecha, Andriy Zakutayev, Wyatt K. Metzger, Paul Paret, Gilberto Moreno, Bidzina Kekelia, Kevin Bennion, Barry Mather, Sreekant Narumanchi, Samuel Kim, Samuel Graham
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A017, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6453
https://doi.org/10.1115/IPACK2019-6453
View Paper titled, Electrothermal Modeling and Analysis of Gallium Oxide Power Switching Devices
Open the PDF for Electrothermal Modeling and Analysis of Gallium Oxide Power Switching Devices in another window
Topics: Electronics, Energy gap, Gallium, Modeling
Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
https://doi.org/10.1115/1.4043406
Published Online: May 8, 2019
View Article titled, Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
Open the PDF for Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages in another window
Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74244
https://doi.org/10.1115/IPACK2017-74244
View Paper titled, Optimization of Graphite Composite Latent Heat Storage Systems
Open the PDF for Optimization of Graphite Composite Latent Heat Storage Systems in another window
Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes

Georges Pavlidis, James Dallas, Sukwon Choi, Shyh-Chiang Shen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A011, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74149
https://doi.org/10.1115/IPACK2017-74149
View Paper titled, Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes
Open the PDF for Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes in another window
Topics: Gallium nitride, Steady state, Thermal characterization, Transients (Dynamics), Temperature, Sapphire, Temperature distribution, Heating, Imaging, Joules
Proceedings Papers

Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management

Luke Yates, Ramez Cheaito, Aditya Sood, Zhe Cheng, Thomas Bougher, Mehdi Asheghi, Kenneth Goodson, Mark Goorsky, Firooz Faili, Dan Twitchen, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74163
https://doi.org/10.1115/IPACK2017-74163
View Paper titled, Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management
Open the PDF for Investigation of the Heterogeneous Thermal Conductivity in Bulk CVD Diamond for Use in Electronics Thermal Management in another window
Topics: Electronics, Synthetic diamonds, Thermal conductivity, Thermal management, Diamonds, Chemical vapor deposition, Electron backscatter diffraction, Lasers, Boron, Heat flux
Journal Articles

Mechanical Behavior of Carbon Nanotube Forests Grown With Plasma Enhanced Chemical Vapor Deposition: Pristine and Conformally Coated

Parisa Pour Shahid Saeed Abadi, Matthew R. Maschmann, Stephen L. Hodson, Timothy S. Fisher, Jeffery W. Baur, Samuel Graham, Baratunde A. Cola
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Technical Briefs
J. Eng. Mater. Technol. July 2017, 139(3): 034502.
Paper No: MATS-15-1149
https://doi.org/10.1115/1.4035622
Published Online: March 23, 2017
View Article titled, Mechanical Behavior of Carbon Nanotube Forests Grown With Plasma Enhanced Chemical Vapor Deposition: Pristine and Conformally Coated
Open the PDF for Mechanical Behavior of Carbon Nanotube Forests Grown With Plasma Enhanced Chemical Vapor Deposition: Pristine and Conformally Coated in another window
Topics: Carbon nanotubes, Mechanical behavior, Plasma-enhanced chemical vapor deposition, Deformation, Stiffness
Proceedings Papers

Transient Thermofluids Analysis of a Ground-Level Integrated Diverse Energy Storage (GLIDES) System

Adewale Odukomaiya, Ayyoub M. Momen, Ahmad Abu-Heiba, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. IMECE2015, Volume 6B: Energy, V06BT07A038, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-50478
https://doi.org/10.1115/IMECE2015-50478
View Paper titled, Transient Thermofluids Analysis of a Ground-Level Integrated Diverse Energy Storage (GLIDES) System
Open the PDF for Transient Thermofluids Analysis of a Ground-Level Integrated Diverse Energy Storage (GLIDES) System in another window
Topics: Energy storage, Thermofluids, Transients (Dynamics), Heat transfer, Amperes, Storage, Compressed air, Density, Differential equations, Electricity (Physics)
Proceedings Papers

The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers

Luke Yates, Thomas L. Bougher, Thomas Beechem, Baratunde A. Cola, Samuel Graham
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A009, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48259
https://doi.org/10.1115/IPACK2015-48259
View Paper titled, The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers
Open the PDF for The Impact of Interfacial Layers on the Thermal Boundary Resistance and Residual Stress in GaN on Si Epitaxial Layers in another window
Topics: Gallium nitride, Interfacial thermal resistance, Stress, Polishing equipment, Electronics, Crystal structure, Electron mobility, Flow (Dynamics), Heat, Reliability
Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73158
https://doi.org/10.1115/IPACK2013-73158
View Paper titled, Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites
Open the PDF for Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites in another window
Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Modeling the Hotspot Temperature in AlGaN/GaN High Electron Mobility Transistors Using a Non-Gray Phonon BTE Solver

Fatma Nazli Donmezer, Munmun Islam, Samuel Graham, Douglas Yoder
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 1175-1188, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89720
https://doi.org/10.1115/IMECE2012-89720
View Paper titled, Modeling the Hotspot Temperature in AlGaN/GaN High Electron Mobility Transistors Using a Non-Gray Phonon BTE Solver
Open the PDF for Modeling the Hotspot Temperature in AlGaN/GaN High Electron Mobility Transistors Using a Non-Gray Phonon BTE Solver in another window
Topics: Electron mobility, Gallium nitride, Modeling, Phonons, Temperature, Transistors, Electrons, Electromagnetic spectrum, Gates (Closures), Electric fields
Journal Articles

A Comparative Study of Thermal Metrology Techniques for Ultraviolet Light Emitting Diodes

Shweta Natarajan, Yishak Habtemichael, Samuel Graham
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. September 2013, 135(9): 091201.
Paper No: HT-12-1474
https://doi.org/10.1115/1.4024359
Published Online: July 26, 2013
View Article titled, A Comparative Study of Thermal Metrology Techniques for Ultraviolet Light Emitting Diodes
Open the PDF for A Comparative Study of Thermal Metrology Techniques for Ultraviolet Light Emitting Diodes in another window
Topics: Infrared spectroscopy, Light-emitting diodes, Metrology, Temperature, Temperature measurement, Ultraviolet radiation, Spectroscopy, Sapphire, Stress
Proceedings Papers

Thermal Characterization of Discrete Device Layers in Al x Ga 1−x N Based Ultraviolet Light Emitting Diodes

Shweta Natarajan, Bobby G. Watkins, Vinod Adivarahan, Asif Khan, Samuel Graham
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 695-705, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75146
https://doi.org/10.1115/MNHMT2012-75146
View Paper titled, Thermal Characterization of Discrete Device Layers in Al x Ga 1−x N Based Ultraviolet Light Emitting Diodes
Open the PDF for Thermal Characterization of Discrete Device Layers in Al x Ga 1−x N Based Ultraviolet Light Emitting Diodes in another window
Topics: Thermal characterization, Ultraviolet radiation, Temperature, Electroluminescence, Light-emitting diodes, Raman spectroscopy, Quantum wells, Reliability, Temperature measurement, Thermal management
Proceedings Papers

Lattice Boltzmann and Discrete Ordinates Methods for Phonon Transport Modeling: A Comparative Study

Fatma Nazli Donmezer, Dhruv Singh, William James, Adam Christensen, Samuel Graham, Jayathi Y. Murthy
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 333-343, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-64008
https://doi.org/10.1115/IMECE2011-64008
View Paper titled, Lattice Boltzmann and Discrete Ordinates Methods for Phonon Transport Modeling: A Comparative Study
Open the PDF for Lattice Boltzmann and Discrete Ordinates Methods for Phonon Transport Modeling: A Comparative Study in another window
Topics: Lattice Boltzmann methods, Modeling, Phonons, Errors, Resolution (Optics), Acoustics, Engineering simulation, Heat, Nanoscale phenomena, Polarization (Electricity)
Journal Articles

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020901.
https://doi.org/10.1115/1.4005909
Published Online: June 11, 2012
View Article titled, Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique
Open the PDF for Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique in another window
Topics: Bonding, Carbon nanotubes, Diffusion bonding (Metals), Steady state, Test facilities, Testing, Pressure, Thermal resistance, Nanotubes, Solders
Proceedings Papers

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 231-240, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52148
https://doi.org/10.1115/IPACK2011-52148
View Paper titled, Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique
Open the PDF for Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique in another window
Topics: Carbon, Nanotubes, Steady state, Carbon nanotubes, Bonding, Design, Heat, Nanomaterials, Optimization, Pressure
Journal Articles

A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials

Satish Kumar, Baratunde A. Cola, Roderick Jackson, Samuel Graham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020906.
https://doi.org/10.1115/1.4004220
Published Online: June 17, 2011
View Article titled, A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials
Open the PDF for A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials in another window
Topics: Carbon nanotubes, Electrodes