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Proceedings Papers

Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging

Qinglei Sun, Yang Peng, Hao Cheng, Yun Mou, Mingxiang Chen
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A006, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6616
https://doi.org/10.1115/IPACK2019-6616
View Paper titled, Direct Ink Printing of Cavities in DPC Ceramic Substrates With Kaolin Pastes for Hermetic Packaging
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Topics: Cavities, Ceramics, Inks, Kaolin, Packaging, Printing, Rheology
Journal Articles

Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies

Yang Peng, Renli Liang, Yun Mou, Jiangnan Dai, Mingxiang Chen, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040804.
Paper No: EP-18-1089
https://doi.org/10.1115/1.4044624
Published Online: September 19, 2019
View Article titled, Progress and Perspective of Near-Ultraviolet and Deep-Ultraviolet Light-Emitting Diode Packaging Technologies
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Topics: Light-emitting diodes, Packaging, Ultraviolet radiation
Journal Articles

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
https://doi.org/10.1115/1.4043645
Published Online: May 24, 2019
View Article titled, Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
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Topics: Cements (Adhesives), Ceramics, Dams, Manufacturing, Reliability, Shear strength, Low temperature, Molding, Temperature, Viscosity
Proceedings Papers

All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes

Yang Peng, Yun Mou, Xujia Xu, Hao Cheng, Hong Li, Mingxiang Chen, Xiaobing Luo
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8225
https://doi.org/10.1115/IPACK2018-8225
View Paper titled, All-Inorganic Multi-Color Converter Based on Eu3+-Doped Phosphor-in-Glass for White Light-Emitting Diodes
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Topics: Glass, Light-emitting diodes, Phosphors, Emissions, Ions, Low temperature, Melting, Printing, Rendering, Sintering
Journal Articles

A Novel Ceramic Packaging Technique Using Selective Induction Heating

Sheng Liu, Wenming Liu, Changyong Lin, Mingxiang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041010.
https://doi.org/10.1115/1.4000366
Published Online: November 12, 2009
View Article titled, A Novel Ceramic Packaging Technique Using Selective Induction Heating
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Topics: Ceramics, Electromagnetic induction, Heating, Packaging, Temperature
Proceedings Papers

Wafer-Level MEMS Package by Gold-Tin Bonding Method

Sihai Chen, Sheng Liu, Mingxiang Chen, Tao Xiong, Daming Zhang, Honghai Zhang, Xinjian Yi
Proc. ASME. IMECE2003, Microelectromechanical Systems, 169-172, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-43467
https://doi.org/10.1115/IMECE2003-43467
View Paper titled, Wafer-Level MEMS Package by Gold-Tin Bonding Method
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Topics: Bonding, MEMS packages, Semiconductor wafers, Heating, Tin, Metals, Microelectromechanical systems, Annealing, Ovens, Reliability