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M. Z. Abdullah
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Journal Articles

Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods

Muhammad Naqib Nashrudin, Aizat Abas, M. Z. Abdullah, M. Yusuf Tura Ali, Z. Samsudin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031005.
Paper No: EP-20-1106
https://doi.org/10.1115/1.4049175
Published Online: January 19, 2021
View Article titled, Study of Different Dispensing Patterns of No-Flow Underfill Using Numerical and Experimental Methods
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Topics: Flow (Dynamics), Pressure, Ball-Grid-Array packaging
Journal Articles

Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation

Fei Chong Ng, Aizat Abas, M. Z. Abdullah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041009.
Paper No: EP-19-1066
https://doi.org/10.1115/1.4044817
Published Online: October 18, 2019
View Article titled, Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation
Open the PDF for Regional Segregation With Spatial Considerations-Based Analytical Filling Time Model for Non-Newtonian Power-Law Underfill Fluid in Flip-Chip Encapsulation in another window
Topics: Flip-chip, Flow (Dynamics), Fluids, Pressure
Journal Articles

Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates

C. Y. Khor, M. Z. Abdullah, M. Abdul Mujeebu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011003.
https://doi.org/10.1115/1.4005914
Published Online: March 19, 2012
View Article titled, Influence of Gap Height in Flip Chip Underfill Process With Non-Newtonian Flow Between Two Parallel Plates
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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Non-Newtonian flow, Plates (structures), Fluids, Simulation, Computational fluid dynamics, Finite volume methods, Pressure drop
Journal Articles

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu, Horizon Gitano, Z. M. Ariff, R. Razali, K. A. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
https://doi.org/10.1115/1.4000719
Published Online: March 4, 2010
View Article titled, Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
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Topics: Cavities, Computer simulation, Epoxy adhesives, Epoxy resins, Finite difference methods, Flow (Dynamics), Integrated circuits, Molding, Pressure, Simulation