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James M. Pitarresi
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Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
https://doi.org/10.1115/1.4040923
Published Online: August 20, 2018
View Article titled, Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
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Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders
Journal Articles

Analytical Solution for Electronic Assemblies Under Vibration

Mohammad A. Gharaibeh, Quang T. Su, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011003.
Paper No: EP-15-1113
https://doi.org/10.1115/1.4032497
Published Online: March 10, 2016
View Article titled, Analytical Solution for Electronic Assemblies Under Vibration
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Topics: Finite element analysis, Mode shapes, Solder joints, Solders, Stiffness, Stress, Vibration, Manufacturing, Deflection, Modal analysis
Proceedings Papers

Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Qiang Xiao, William D. Armstrong, James M. Pitarresi, Satish C. Chaparala, Brian D. Rogeman, Bahgat G. Sammakia, Luu Nguyen
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1459-1470, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73239
https://doi.org/10.1115/IPACK2005-73239
View Paper titled, Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy
Open the PDF for Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy in another window
Topics: Alloys, Creep, Heat, Manufacturing, Modeling, Surface mount devices, Bulk solids, Solders, Solder joints, Thermomechanics
Journal Articles

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

S. B. Park, Chirag Shah, Jae B. Kwak, Changsoo Jang, Soonwan Chung, James M. Pitarresi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
https://doi.org/10.1115/1.3000097
Published Online: November 17, 2008
View Article titled, Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation
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Topics: Accelerometers, Deformation, Dynamic response, Printed circuit boards, Strain gages, Transients (Dynamics), Lumber, Displacement
Proceedings Papers

Computationally Efficient Approaches to Simulate the Dynamics of Microbeams Under Mechanical Shock

Mohammad I. Younis, Danial Jordy, James M. Pitarresi
Proc. ASME. IMECE2006, Applied Mechanics, 315-324, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-14115
https://doi.org/10.1115/IMECE2006-14115
View Paper titled, Computationally Efficient Approaches to Simulate the Dynamics of Microbeams Under Mechanical Shock
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Topics: Dynamics (Mechanics), Microbeams, Shock (Mechanics), Dampers, Damping, Dynamic testing (Materials), Engineering simulation, Finite element model, Simulation, Springs