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Journal Articles

Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages

Darshan G. Pahinkar, Lauren Boteler, Dimeji Ibitayo, Sreekant Narumanchi, Paul Paret, Douglas DeVoto, Joshua Major, Samuel Graham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041001.
Paper No: EP-18-1031
https://doi.org/10.1115/1.4043406
Published Online: May 8, 2019
View Article titled, Liquid-Cooled Aluminum Silicon Carbide Heat Sinks for Reliable Power Electronics Packages
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Topics: Cooling, Flow (Dynamics), Heat, Heat sinks, Temperature, Geometry, Coolants, Fins, Silicon, Electronic packages
Proceedings Papers

Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging

Marco J. Echeverría, Pedro O. Quintero, Dimeji Ibitayo, Lauren Boteler
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8279
https://doi.org/10.1115/IPACK2018-8279
View Paper titled, Numerical Approach to Cold Gas Spray on Ceramic Substrates for Power Electronics Packaging
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Topics: Ceramics, Electronic packaging, Sprays, Copper, Manufacturing, Reliability, Aluminum, Bonding, Brittleness, Computer simulation
Proceedings Papers

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8355
https://doi.org/10.1115/IPACK2018-8355
View Paper titled, Multifunctional Chip for Use in Thermal Analysis of Power Systems
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Topics: Design, Electronic systems, Flux (Metallurgy), Heat, Heat flux, High temperature, Instrumentation, Junctions, Military systems, Power systems (Machinery)
Proceedings Papers

Integrated Vapor Chamber Heat Spreader for Power Module Applications

Clayton L. Hose, Dimeji Ibitayo, Lauren M. Boteler, Jens Weyant, Bradley Richard
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A013, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74132
https://doi.org/10.1115/IPACK2017-74132
View Paper titled, Integrated Vapor Chamber Heat Spreader for Power Module Applications
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Topics: Flat heat pipes, Vapors, Heat, Heat flux, Copper, Electronics, Flux (Metallurgy), Thermal resistance, Flow (Dynamics), Modeling
Proceedings Papers

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

David Gonzalez-Nino, Lauren M. Boteler, Nicholas R. Jankowski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 29–September 1, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2017-74118
https://doi.org/10.1115/IPACK2017-74118
View Paper titled, Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading
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Topics: Phase change materials, Heat, Silicon nitride ceramics, Temperature, Cooling, Cooling systems, Cycles, Inspection, Optical quality control, Temperature profiles
Proceedings Papers

Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications

David Gonzalez-Nino, Lauren M. Boteler, Dimeji Ibitayo, Nicholas R. Jankowski, Pedro O. Quintero
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A004, July 10–14, 2016
Publisher: American Society of Mechanical Engineers
Paper No: HT2016-7223
https://doi.org/10.1115/HT2016-7223
View Paper titled, Numerical Evaluation of Multiple Phase Change Materials for Pulsed Electronics Applications
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Topics: Electronics, Phase change materials, Heat, Tin, Transients (Dynamics), Stress, Thermal conductivity, Absorption, Finite difference methods, Gallium
Proceedings Papers

Microstructural Stability of Au-Sn SLID Joints for Harsh Environments

Paola Rivera Soto, Pedro O. Quintero, Mellyssa Mulero, Dimeji Ibitayo
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A035, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48323
https://doi.org/10.1115/IPACK2015-48323
View Paper titled, Microstructural Stability of Au-Sn SLID Joints for Harsh Environments
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Topics: Stability, Tin, Bonding, Melting point, Fracture (Materials), Copper, Diffusion (Physics), Electronic packaging, Intermetallic compounds, Microscopy
Proceedings Papers

High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion

Rogie I. Rodriguez, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 9-17, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52049
https://doi.org/10.1115/IPACK2011-52049
View Paper titled, High Temperature Die Attach by Low Temperature Solid-Liquid Interdiffusion
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Topics: High temperature, Low temperature, Temperature, Tin, Diffusion (Physics), Melting point, Bonding, Electromechanical devices, Electronic packaging, Electronics
Proceedings Papers

Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices

Lauren Everhart, Nicholas Jankowski, Bruce Geil, Andrew Bayba, Dimeji Ibitayo, Patrick McCluskey
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 285-292, June 18–20, 2007
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2007-30190
https://doi.org/10.1115/ICNMM2007-30190
View Paper titled, Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices
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Topics: Cooling, Manifolds, Microchannels, Design, Engineering simulation, Manufacturing, Pressure drop, Simulation, Flow (Dynamics), Heat