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1-7 of 7
Daniel P. Rini
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Proceedings Papers
Proc. ASME. HT2008, Heat Transfer: Volume 2, 581-587, August 10–14, 2008
Publisher: American Society of Mechanical Engineers
Paper No: HT2008-56384
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. July 2009, 131(7): 071401.
Published Online: May 5, 2009
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. October 2008, 130(10): 101501.
Published Online: August 7, 2008
Proceedings Papers
Proc. ASME. IMECE2005, Heat Transfer, Part A, 709-716, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80333
Proceedings Papers
Proc. ASME. IMECE2005, Heat Transfer, Part B, 247-254, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80456
Journal Articles
Robert G. Mertens, Louis Chow, Kalpathy B. Sundaram, R. Brian Cregger, Daniel P. Rini, Louis Turek, Benjamin A. Saarloos
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 316–323.
Published Online: May 18, 2007
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. February 2002, 124(1): 63–72.
Published Online: June 5, 2001