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Proceedings Papers

Micro Protein Arrays Prepared by Microfabricated Stamps

F. G. Tseng, H. M. Huang, C. S. Liu, C. Y. Huang, S. C. Lin, C. C. Chieng
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 659-665, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1160
https://doi.org/10.1115/IMECE2000-1160
View Paper titled, Micro Protein Arrays Prepared by Microfabricated Stamps
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Topics: Microfabrication, Proteins, Aluminum, Metal stamping, Absorption, Biological tissues, Coating processes, Coatings, Manufacturing, Micromachining
Proceedings Papers

Influence of Rotating Directions on Hydro-Thermal Characteristics of a Two-Pass Parallelogram Channel With Detached Transverse Ribs

T. M. Liou, C. Y. Huang, I. A. Lan, S. P. Chan, S. W. Chang
Proc. ASME. GT2018, Volume 5A: Heat Transfer, V05AT11A002, June 11–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: GT2018-75278
https://doi.org/10.1115/GT2018-75278
View Paper titled, Influence of Rotating Directions on Hydro-Thermal Characteristics of a Two-Pass Parallelogram Channel With Detached Transverse Ribs
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Topics: Buoyancy, Coriolis force, Density, Flow (Dynamics), Friction, Heat transfer, Reynolds number
Proceedings Papers

Mode Coupling Behavior in End Milling

C. Y. Huang, J.-J. Junz Wang
Proc. ASME. IMECE2009, Volume 10: Mechanical Systems and Control, Parts A and B, 875-884, November 13–19, 2009
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2009-10861
https://doi.org/10.1115/IMECE2009-10861
View Paper titled, Mode Coupling Behavior in End Milling
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Topics: Chatter, Milling
Proceedings Papers

An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging

M. Y. Tsai, C. Y. Huang, C. Y. Chiang, C. Y. Wu, S. S. Yang
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 711-717, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33967
https://doi.org/10.1115/IPACK2007-33967
View Paper titled, An Approach to Determining Residual Strains and Moisture Diffusion Coefficients of Cured Adhesives in Electronic Packaging
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Topics: Adhesives, Diffusion (Physics), Electronic packaging, Temperature, Shrinkage (Materials), Stress, Finite element methods, Relaxation (Physics), Design, Hardening (Curing)
Journal Articles

Strain-Dependent Oxygen Diffusivity in Bovine Annulus Fibrosus

T.-Y. Yuan, A. R. Jackson, C.-Y. Huang, W. Y. Gu
Journal: Journal of Biomechanical Engineering
Publisher: ASME
Article Type: Technical Briefs
J Biomech Eng. July 2009, 131(7): 074503.
https://doi.org/10.1115/1.3127254
Published Online: June 4, 2009
View Article titled, Strain-Dependent Oxygen Diffusivity in Bovine Annulus Fibrosus
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Topics: Compression, Oxygen, Annulus, Biological tissues, Diffusion (Physics), Intervertebral discs
Proceedings Papers

The Effect of Harmonic Force Components on Regenerative Stability in End Milling

J.-J. Junz Wang, C. M. Zheng, C. Y. Huang
Proc. ASME. IMECE2003, Manufacturing, 103-112, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42367
https://doi.org/10.1115/IMECE2003-42367
View Paper titled, The Effect of Harmonic Force Components on Regenerative Stability in End Milling
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Topics: Cutting, Milling, Stability
Proceedings Papers

A Pole/Zero Placement Approach to Reducing Structure Vibration in End Milling

J.-J. Junz Wang, C. Y. Huang
Proc. ASME. IMECE2003, Manufacturing, 515-521, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-42368
https://doi.org/10.1115/IMECE2003-42368
View Paper titled, A Pole/Zero Placement Approach to Reducing Structure Vibration in End Milling
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Topics: Cutting, Milling, Poles (Building), Vibration
Proceedings Papers

Mechanistic Modeling of Process Damping in Peripheral Milling

C. Y. Huang, J.-J. Junz Wang
Proc. ASME. IMECE2005, Manufacturing Engineering and Materials Handling, Parts A and B, 397-406, November 5–11, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2005-80880
https://doi.org/10.1115/IMECE2005-80880
View Paper titled, Mechanistic Modeling of Process Damping in Peripheral Milling
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Topics: Damping, Die cutting, Milling, Modeling, Shearing (Deformation), Vibration
Proceedings Papers

Study on Copper Cold Plate Designs for Electronics Liquid Cooling System

Yi. Feng, Y. Wang, C. Y. Huang
Proc. ASME. IMECE2006, Heat Transfer, Volume 1, 759-766, November 5–10, 2006
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2006-16242
https://doi.org/10.1115/IMECE2006-16242
View Paper titled, Study on Copper Cold Plate Designs for Electronics Liquid Cooling System
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Topics: Cooling systems, Copper, Electronics, Cooling, Design, Heat exchangers, Heat transfer, Plates (structures), Pumps, Brazing
Journal Articles

Mechanistic Modeling of Process Damping in Peripheral Milling

C. Y. Huang, J. J. Junz Wang
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Papers
J. Manuf. Sci. Eng. February 2007, 129(1): 12–20.
https://doi.org/10.1115/1.2335857
Published Online: March 22, 2006
View Article titled, Mechanistic Modeling of Process Damping in Peripheral Milling
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Topics: Cutting, Damping, Milling, Vibration, Die cutting, Shearing (Deformation)