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Aaron P. Wemhoff
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Proceedings Papers

The Difference in Blue Water Usage of Meals Prepared at Home Versus Meals Prepared Away From Home

Schuyler Sices, Aaron P. Wemhoff
Proc. ASME. ES2023, ASME 2023 17th International Conference on Energy Sustainability, V001T04A001, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: ES2023-106820
https://doi.org/10.1115/ES2023-106820
View Paper titled, The Difference in Blue Water Usage of Meals Prepared at Home Versus Meals Prepared Away From Home
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Topics: Food products, Water
Proceedings Papers

Data Center Environmental Burden Reduction Through On-Site Renewable Power Generation

Matthew McMullen, Aaron P. Wemhoff
Proc. ASME. ES2023, ASME 2023 17th International Conference on Energy Sustainability, V001T02A015, July 10–12, 2023
Publisher: American Society of Mechanical Engineers
Paper No: ES2023-107496
https://doi.org/10.1115/ES2023-107496
View Paper titled, Data Center Environmental Burden Reduction Through On-Site Renewable Power Generation
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Topics: Carbon, Data centers, Renewable energy, Water
Proceedings Papers

Predictions of Airside Economization-Based Air-Cooled Data Center Environmental Burden Reduction

Li Chen, Aaron P. Wemhoff
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-92005
https://doi.org/10.1115/IPACK2022-92005
View Paper titled, Predictions of Airside Economization-Based Air-Cooled Data Center Environmental Burden Reduction
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Topics: Carbon, Data centers, Energy consumption, Stress, Water
Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Lucas Arrivo, Steven Schon, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73015
https://doi.org/10.1115/IPACK2021-73015
View Paper titled, Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers
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Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling
Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A012, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73269
https://doi.org/10.1115/IPACK2021-73269
View Paper titled, Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Evaporator Model
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Topics: Compression, Cooling, Data centers, Heat recovery, Vapors
Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A013, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73270
https://doi.org/10.1115/IPACK2021-73270
View Paper titled, Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Condenser Model
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Topics: Compression, Condensers (steam plant), Cooling, Heat recovery, Modeling, Thermal management, Vapors
Proceedings Papers

Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model

Rehan Khalid, Raffaele Luca Amalfi, Aaron P. Wemhoff
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A014, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-73271
https://doi.org/10.1115/IPACK2021-73271
View Paper titled, Rack-Level Thermosyphon Cooling and Vapor-Compression Driven Heat Recovery: Compressor Model
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Topics: Compression, Compressors, Cooling, Heat recovery, Modeling, Thermal management, Vapors
Journal Articles

Coupled Calculations of Data Center Cooling and Power Distribution Systems

Aaron P. Wemhoff, Faisal Ahmed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041002.
Paper No: EP-21-1044
https://doi.org/10.1115/1.4052101
Published Online: October 6, 2021
View Article titled, Coupled Calculations of Data Center Cooling and Power Distribution Systems
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Topics: Cooling, Cooling systems, Data centers, Power systems (Machinery), Stress, Energy efficiency, Electronic systems, Uncertainty
Journal Articles

Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers

Sebastian Araya, Aaron P. Wemhoff, Gerard F. Jones, Amy S. Fleischer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021001.
Paper No: EP-19-1102
https://doi.org/10.1115/1.4047843
Published Online: August 7, 2020
View Article titled, Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers
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Topics: Heat, Heat recovery, Organic Rankine cycle, Temperature, Data centers, Pumps
Journal Articles

Thermal Control Strategies for Reliable and Energy-Efficient Data Centers

Rehan Khalid, Aaron P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041004.
Paper No: EP-18-1058
https://doi.org/10.1115/1.4044129
Published Online: July 12, 2019
View Article titled, Thermal Control Strategies for Reliable and Energy-Efficient Data Centers
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Topics: Cooling systems, Data centers, Energy consumption, Flow (Dynamics), Reliability, Temperature, Energy efficiency, Simulation, Control equipment
Journal Articles

The Performance Impact of Integrating Water Storage Into a Chiller-Less Data Center Design

Isaac Rose, Aaron P. Wemhoff, Amy S. Fleischer
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2019, 11(2): 021010.
Paper No: TSEA-17-1498
https://doi.org/10.1115/1.4041804
Published Online: December 5, 2018
View Article titled, The Performance Impact of Integrating Water Storage Into a Chiller-Less Data Center Design
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Topics: Cooling, Data centers, Design, Exergy, Flow (Dynamics), Temperature, Water, Water storage, Cooling towers, Heat exchangers
Proceedings Papers

Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling

Joseph R. H. Schaadt, Kamran Fouladi, Aaron P. Wemhoff, Joseph G. Pigeon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A020, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48364
https://doi.org/10.1115/IPACK2015-48364
View Paper titled, Load Capacity and Thermal Efficiency Optimization of a Research Data Center Using Computational Modeling
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Topics: Computer simulation, Data centers, Optimization, Stress, Thermal efficiency, Design, Containment, Computational fluid dynamics, Air conditioning, Flow (Dynamics)
Proceedings Papers

Predictions of Adsorption Enthalpy on Graphitic Surfaces Using Statistical Thermodynamics

Aaron P. Wemhoff
Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A017, July 14–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: HT2013-17365
https://doi.org/10.1115/HT2013-17365
View Paper titled, Predictions of Adsorption Enthalpy on Graphitic Surfaces Using Statistical Thermodynamics
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Topics: Enthalpy, Statistical mechanics, Fluids, Graphite, Desorption, Methanol, Temperature
Proceedings Papers

Molecular-Based Theory for Drag on a Circular Cylinder by a Liquid

Aaron P. Wemhoff
Proc. ASME. IMECE2012, Volume 7: Fluids and Heat Transfer, Parts A, B, C, and D, 975-982, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-87895
https://doi.org/10.1115/IMECE2012-87895
View Paper titled, Molecular-Based Theory for Drag on a Circular Cylinder by a Liquid
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Topics: Circular cylinders, Drag (Fluid dynamics), Fluids, Blood vessels, Chain, Fibers, Linings (Textiles), Proteins
Proceedings Papers

GPU-Based Molecular Dynamics Formulation of Thermal Conductivity Predictions for Monolayer Graphene

Aaron P. Wemhoff, Masoud H. Khadem
Proc. ASME. HT2012, Volume 2: Heat Transfer Enhancement for Practical Applications; Fire and Combustion; Multi-Phase Systems; Heat Transfer in Electronic Equipment; Low Temperature Heat Transfer; Computational Heat Transfer, 891-896, July 8–12, 2012
Publisher: American Society of Mechanical Engineers
Paper No: HT2012-58020
https://doi.org/10.1115/HT2012-58020
View Paper titled, GPU-Based Molecular Dynamics Formulation of Thermal Conductivity Predictions for Monolayer Graphene
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Topics: Graphene, Graphics processing units, Molecular dynamics, Thermal conductivity, Computation, Engineering simulation, Equilibrium (Physics), Errors, Heat, Potential energy
Proceedings Papers

Directing Supervisory Control Towards Real HVAC System Integration

Aaron P. Wemhoff, William Flaherty
Proc. ASME. IMECE2011, Volume 4: Energy Systems Analysis, Thermodynamics and Sustainability; Combustion Science and Engineering; Nanoengineering for Energy, Parts A and B, 923-929, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62529
https://doi.org/10.1115/IMECE2011-62529
View Paper titled, Directing Supervisory Control Towards Real HVAC System Integration
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Topics: HVAC equipment, Energy consumption, Air conditioning, Air flow, Algorithms, Computer software, Control equipment, Heating, Stress, Transients (Dynamics)
Proceedings Papers

Thermal Conductivity Estimation of Nano Graphene Using Equilibrium Molecular Dynamics With Andersen and Berendsen Thermostats

Masoud H. Khadem, Aaron P. Wemhoff
Proc. ASME. IMECE2011, Volume 10: Heat and Mass Transport Processes, Parts A and B, 293-299, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62562
https://doi.org/10.1115/IMECE2011-62562
View Paper titled, Thermal Conductivity Estimation of Nano Graphene Using Equilibrium Molecular Dynamics With Andersen and Berendsen Thermostats
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Topics: Equilibrium (Physics), Graphene, Molecular dynamics, Temperature controls, Thermal conductivity, Atoms, Carbon, Engineering simulation, Fluctuations (Physics), Heat
Journal Articles

Thermophysical Phenomena Associated With Nano-Droplet Impingement on a Solid Surface

Geoffrey M. Haas, Aaron P. Wemhoff
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Evaporation, Boiling, and Condensation
J. Heat Mass Transfer. July 2012, 134(7): 071503.
https://doi.org/10.1115/1.4006099
Published Online: May 24, 2012
View Article titled, Thermophysical Phenomena Associated With Nano-Droplet Impingement on a Solid Surface
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Topics: Drops, Temperature
Proceedings Papers

HVAC System Energy Minimization via Optimization of Lumped System Models

Aaron P. Wemhoff
Proc. ASME. IMECE2010, Volume 5: Energy Systems Analysis, Thermodynamics and Sustainability; NanoEngineering for Energy; Engineering to Address Climate Change, Parts A and B, 1339-1345, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-37163
https://doi.org/10.1115/IMECE2010-37163
View Paper titled, HVAC System Energy Minimization via Optimization of Lumped System Models
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Topics: Energy conservation, HVAC equipment, Optimization, Steady state, Stress, Air conditioning, Energy consumption, Heating, Interpolation, Simulation
Proceedings Papers

Nano-Droplet Impingement Heat Transfer on a Solid Surface

Geoffrey Haas, Aaron P. Wemhoff
Proc. ASME. IMECE2010, Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B, 83-88, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-39734
https://doi.org/10.1115/IMECE2010-39734
View Paper titled, Nano-Droplet Impingement Heat Transfer on a Solid Surface
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Topics: Drops, Heat transfer, Cooling, Nanoscale phenomena, Simulation, Collisions (Physics), Dimensions, Electronic components, Electronics, Molecular dynamics