Three-dimensional (3D) printing of microscale structures with high-resolution (submicron) and low-cost is still a challenging work for the existing 3D printing techniques. Here, we report a direct writing process via near-field melt electrospinning (NFME) to achieve microscale printing of single filament wall structures. The process allows continuous direct writing due to the linear and stable jet trajectory in the electric near field. The layer-by-layer stacking of fibers, or self-assembly effect, is attributed to the attraction force from the molten deposited fibers and accumulated negative charges. We demonstrated successful printing of various 3D thin-wall structures with a minimal wall thickness less than 5 μm. By optimizing the process parameters of NFME, ultrafine poly (ε-caprolactone) (PCL) fibers have been stably generated and precisely stacked and fused into 3D thin-wall structures with an aspect ratio of more than 60. It is envisioned that the NFME can be transformed into a viable high-resolution and low-cost microscale 3D printing technology.
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December 2017
Research-Article
Study of Microscale Three-Dimensional Printing Using Near-Field Melt Electrospinning
Xiangyu You,
Xiangyu You
Department of Mechanical and Automation Engineering,
The Chinese University of Hong Kong,
Hong Kong, China
The Chinese University of Hong Kong,
Hong Kong, China
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Chengcong Ye,
Chengcong Ye
Department of Mechanical and Automation Engineering,
The Chinese University of Hong Kong,
Hong Kong, China
The Chinese University of Hong Kong,
Hong Kong, China
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Ping Guo
Ping Guo
Mem. ASME
Department of Mechanical and Automation Engineering,
The Chinese University of Hong Kong,
Hong Kong, China
e-mail: pguo@mae.cuhk.edu.hk
Department of Mechanical and Automation Engineering,
The Chinese University of Hong Kong,
Hong Kong, China
e-mail: pguo@mae.cuhk.edu.hk
Search for other works by this author on:
Xiangyu You
Department of Mechanical and Automation Engineering,
The Chinese University of Hong Kong,
Hong Kong, China
The Chinese University of Hong Kong,
Hong Kong, China
Chengcong Ye
Department of Mechanical and Automation Engineering,
The Chinese University of Hong Kong,
Hong Kong, China
The Chinese University of Hong Kong,
Hong Kong, China
Ping Guo
Mem. ASME
Department of Mechanical and Automation Engineering,
The Chinese University of Hong Kong,
Hong Kong, China
e-mail: pguo@mae.cuhk.edu.hk
Department of Mechanical and Automation Engineering,
The Chinese University of Hong Kong,
Hong Kong, China
e-mail: pguo@mae.cuhk.edu.hk
1Corresponding author.
Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MICRO- AND NANO-MANUFACTURING. Manuscript received June 14, 2017; final manuscript received August 21, 2017; published online September 27, 2017. Assoc. Editor: Yayue Pan.
J. Micro Nano-Manuf. Dec 2017, 5(4): 040901 (5 pages)
Published Online: September 27, 2017
Article history
Received:
June 14, 2017
Revised:
August 21, 2017
Citation
You, X., Ye, C., and Guo, P. (September 27, 2017). "Study of Microscale Three-Dimensional Printing Using Near-Field Melt Electrospinning." ASME. J. Micro Nano-Manuf. December 2017; 5(4): 040901. https://doi.org/10.1115/1.4037788
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