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Journal Articles

Effects of Bubbles on Manufacturing Gold Dendrites and Silicon Nanowires Through the Fluoride-Assisted Galvanic Replacement Reaction

Pee-Yew Lee, Hung Ji Huang, Tsung-Shine Ko, Ying-Lun Hung, Li-Yan Wu, Jia-Jun Fan, Yung-Sheng Lin
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. November 2023, 145(11): 114501.
Paper No: MANU-23-1284
https://doi.org/10.1115/1.4062878
Published Online: July 21, 2023
View Article titled, Effects of Bubbles on Manufacturing Gold Dendrites and Silicon Nanowires Through the Fluoride-Assisted Galvanic Replacement Reaction
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Topics: Bubbles, Manufacturing, Metals, Nanowires, Silicon, Vacuum, Semiconductor wafers, Chemical etching, Etching
Journal Articles

Bubble Effects on Manufacturing of Silicon Nanowires by Metal-Assisted Chemical Etching

Pee-Yew Lee, Chun-Jen Weng, Hung Ji Huang, Li-Yan Wu, Guo-Hao Lu, Chao-Feng Liu, Cheng-You Chen, Ting-Yu Li, Yung-Sheng Lin
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. September 2023, 145(9): 094501.
Paper No: MANU-23-1086
https://doi.org/10.1115/1.4062392
Published Online: May 9, 2023
View Article titled, Bubble Effects on Manufacturing of Silicon Nanowires by Metal-Assisted Chemical Etching
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Topics: Bubbles, Chemical etching, Etching, Hydrogen, Metals, Nanowires, Semiconductor wafers, Manufacturing, Silicon
Journal Articles

Optical Metrology of Critical Dimensions in Large-Area Nanostructure Arrays With Complex Patterns

Ramin Sabbagh, Alec Stothert, S. V. Sreenivasan, Dragan Djurdjanovic
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2023, 145(6): 061010.
Paper No: MANU-22-1619
https://doi.org/10.1115/1.4056923
Published Online: March 14, 2023
View Article titled, Optical Metrology of Critical Dimensions in Large-Area Nanostructure Arrays With Complex Patterns
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Topics: Dimensions, Gages, Inspection, Inverse problems, Metrology, Reflectance, Semiconductor wafers, Spectra (Spectroscopy), Optimization, Simulation
Journal Articles

Precision Silicon Exfoliation Tool Design

Martin J. Ward, Dipankar Behera, Michael A. Cullinan
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. February 2023, 145(2): 024501.
Paper No: MANU-22-1105
https://doi.org/10.1115/1.4055320
Published Online: September 27, 2022
View Article titled, Precision Silicon Exfoliation Tool Design
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Topics: Design, Metrology, Semiconductor wafers, Silicon, Stress, Surface roughness, Errors, Nickel, Film thickness, Engineering prototypes
Journal Articles

Study on Controllable Thickness and Flatness of Wafer-Scale Nickel Shim in Precision Electroforming Process: Simulation and Validation

Honggang Zhang, Nan Zhang, Fengzhou Fang
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. November 2021, 143(11): 111005.
Paper No: MANU-20-1688
https://doi.org/10.1115/1.4051006
Published Online: June 11, 2021
View Article titled, Study on Controllable Thickness and Flatness of Wafer-Scale Nickel Shim in Precision Electroforming Process: Simulation and Validation
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Topics: Current density, Electroforming, Nickel, Semiconductor wafers, Electrodeposition
Journal Articles

Influence of Precursor Concentration on Crystalline Quality of GaN Thin Films Grown on a Sapphire Wafer

Omar Dhannoon Jumaah, Yogesh Jaluria
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. November 2021, 143(11): 111001.
Paper No: MANU-21-1071
https://doi.org/10.1115/1.4050825
Published Online: May 7, 2021
View Article titled, Influence of Precursor Concentration on Crystalline Quality of GaN Thin Films Grown on a Sapphire Wafer
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Topics: Gallium nitride, Thin films, Semiconductor wafers, Sapphire, Metalorganic chemical vapor deposition, Atomic force microscopy, Dislocation density
Journal Articles

Experimental Study of the Impact of a Vibrating Wire on Free Abrasive Machining as Correlated to the Modeling of Vibration Subject to an Oscillating Boundary Condition

Liming Li, Imin Kao
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. May 2021, 143(5): 051006.
Paper No: MANU-20-1189
https://doi.org/10.1115/1.4048637
Published Online: November 11, 2020
View Article titled, Experimental Study of the Impact of a Vibrating Wire on Free Abrasive Machining as Correlated to the Modeling of Vibration Subject to an Oscillating Boundary Condition
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Topics: Oscillations, Vibration, Wire, Semiconductor wafers, Slurries, Abrasive machining, Boundary-value problems
Journal Articles

Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering

Jingfei Yin, Qian Bai, Bi Zhang
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. October 2019, 141(10): 101012.
Paper No: MANU-18-1639
https://doi.org/10.1115/1.4044417
Published Online: September 4, 2019
View Article titled, Subsurface Damage Detection on Ground Silicon Wafers Using Polarized Laser Scattering
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Topics: Damage, Electromagnetic scattering, Lasers, Radiation scattering, Scattering (Physics), Semiconductor wafers, Stress, Grinding
Journal Articles

Prediction of Material Removal Rate for Chemical Mechanical Planarization Using Decision Tree-Based Ensemble Learning

Zhixiong Li, Dazhong Wu, Tianyu Yu
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. March 2019, 141(3): 031003.
Paper No: MANU-18-1189
https://doi.org/10.1115/1.4042051
Published Online: January 17, 2019
View Article titled, Prediction of Material Removal Rate for Chemical Mechanical Planarization Using Decision Tree-Based Ensemble Learning
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Topics: Algorithms, Modeling, Semiconductor wafers, Feature extraction, Physics
Journal Articles

Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

Bin Lin, Ping Zhou, Ziguang Wang, Ying Yan, Renke Kang, Dongming Guo
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2018, 140(12): 121001.
Paper No: MANU-18-1118
https://doi.org/10.1115/1.4041245
Published Online: September 17, 2018
View Article titled, Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer
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Topics: Cutting, Grinding, Grinding wheels, Semiconductor wafers, Surface roughness
Journal Articles

Microstructural Characterization of Thermal Damage on Silicon Wafers Sliced Using Wire-Electrical Discharge Machining

Kamlesh Joshi, Upendra Bhandarkar, Indradev Samajdar, Suhas S. Joshi
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. September 2018, 140(9): 091001.
Paper No: MANU-17-1751
https://doi.org/10.1115/1.4039647
Published Online: June 4, 2018
View Article titled, Microstructural Characterization of Thermal Damage on Silicon Wafers Sliced Using Wire-Electrical Discharge Machining
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Topics: Damage, Semiconductor wafers, Wire, Electrical discharge machining
Journal Articles

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Ping Zhou, Ying Yan, Ning Huang, Ziguang Wang, Renke Kang, Dongming Guo
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. August 2017, 139(8): 081012.
Paper No: MANU-16-1608
https://doi.org/10.1115/1.4036125
Published Online: May 10, 2017
View Article titled, Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding
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Topics: Deformation, Diamonds, Grinding, Semiconductor wafers, Stress, Wheels, Stress concentration, Damage, Silicon
Journal Articles

Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing

Shujuan Li, Aofei Tang, Yong Liu, Jiabin Wang, Dan Cui, Robert G. Landers
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. April 2017, 139(4): 041003.
Paper No: MANU-16-1250
https://doi.org/10.1115/1.4034792
Published Online: October 18, 2016
View Article titled, Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing
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Topics: Cutting, Semiconductor wafers, Wire, Machining, Modeling, Diamonds
Journal Articles

Analysis of Handling Stresses in Thin Solar Silicon Wafers Generated by a Rigid Vacuum Gripper

Hao Wu, Shreyes N. Melkote
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. March 2016, 138(3): 034501.
Paper No: MANU-15-1058
https://doi.org/10.1115/1.4030763
Published Online: October 1, 2015
View Article titled, Analysis of Handling Stresses in Thin Solar Silicon Wafers Generated by a Rigid Vacuum Gripper
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Topics: Grippers, Semiconductor wafers, Stress, Vacuum, Solar energy
Journal Articles

Force Modeling and Control of SiC Monocrystal Wafer Processing

Shujuan Li, Siming Du, Aofei Tang, Robert G. Landers, Yang Zhang
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research-Article
J. Manuf. Sci. Eng. December 2015, 137(6): 061003.
Paper No: MANU-14-1309
https://doi.org/10.1115/1.4029432
Published Online: September 9, 2015
View Article titled, Force Modeling and Control of SiC Monocrystal Wafer Processing
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Topics: Cutting, Semiconductor wafers, Wire, Machining, Control equipment, Surface roughness, Diamonds, Tension
Journal Articles

Thermal Modeling of Ultraviolet Nanoimprint Lithography

Bhavik C. Patel, Ankur Jain
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Technical Briefs
J. Manuf. Sci. Eng. December 2013, 135(6): 064501.
Paper No: MANU-13-1184
https://doi.org/10.1115/1.4025564
Published Online: November 5, 2013
View Article titled, Thermal Modeling of Ultraviolet Nanoimprint Lithography
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Topics: Design, Lithography, Modeling, Nanomanufacturing, Semiconductor wafers, Temperature, Tradeoffs, Ultraviolet radiation, Thermal management, Heat
Journal Articles

Effect of Substrate Flexibility on the Pressure Distribution and Lifting Force Generated by a Bernoulli Gripper

X. Brun, S. N. Melkote
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. October 2012, 134(5): 051010.
https://doi.org/10.1115/1.4007186
Published Online: September 10, 2012
View Article titled, Effect of Substrate Flexibility on the Pressure Distribution and Lifting Force Generated by a Bernoulli Gripper
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Topics: Air flow, Deformation, Grippers, Pressure, Semiconductor wafers, Modeling
Journal Articles

Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes

Chunhui Chung, Chad S. Korach, Imin Kao
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. June 2011, 133(3): 031006.
https://doi.org/10.1115/1.4004137
Published Online: June 8, 2011
View Article titled, Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes
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Topics: Grinding, Surface roughness, Abrasives, Slurries, Semiconductor wafers, Particulate matter, Modeling
Journal Articles

PDE-Constrained Gaussian Process Model on Material Removal Rate of Wire Saw Slicing Process

Hongxu Zhao, Ran Jin, Su Wu, Jianjun Shi
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2011, 133(2): 021012.
https://doi.org/10.1115/1.4003617
Published Online: March 23, 2011
View Article titled, PDE-Constrained Gaussian Process Model on Material Removal Rate of Wire Saw Slicing Process
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Topics: Wire, Semiconductor wafers
Journal Articles

Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing

Chris Y. Yuan, David A. Dornfeld
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Special Issue On Nanomanufacturing
J. Manuf. Sci. Eng. June 2010, 132(3): 030918.
https://doi.org/10.1115/1.4001686
Published Online: June 14, 2010
View Article titled, Integrated Sustainability Analysis of Atomic Layer Deposition for Microelectronics Manufacturing
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Topics: Cycles, Emissions, Energy consumption, Flow (Dynamics), Manufacturing, Microelectronic devices, Semiconductor wafers, Sustainability, Thin films, Water