An accurate measurement of the thermophysical properties of freestanding thin films is essential for modeling and predicting thermal performance of microsystems. This paper presents a method for simultaneous measurement of in-plane thermal conductivity and heat capacity of freestanding thin films based on the thermal response to a sinusoidal electric current. An analytical model for the temperature response of a freestanding thin film to a sinusoidal heating current passing through a metal heater patterned on top of the thin film is derived. Freestanding thin-film samples of silicon nitride and nickel titanium (NiTi), a shape memory alloy, are microfabricated and characterized. The thermal conductivity of thin-film NiTi, which increases linearly between and , is 40% lower than the bulk value at room temperature. The heat capacity of NiTi also increases linearly with temperature in the low temperature phase and is nearly constant above . The measurement technique developed in this work is expected to contribute to an accurate thermal property measurement of thin-film materials. Thermophysical measurements on NiTi presented in this work are expected to aid in an accurate thermal modeling of microdevices based on the shape memory effect.
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Measurement of the Thermal Conductivity and Heat Capacity of Freestanding Shape Memory Thin Films Using the Method
Ankur Jain,
Ankur Jain
Department of Mechanical Engineering,
e-mail: ankurjain@stanfordalumni.org
Stanford University
, Stanford, CA 94305
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Kenneth E. Goodson
Kenneth E. Goodson
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
Search for other works by this author on:
Ankur Jain
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305e-mail: ankurjain@stanfordalumni.org
Kenneth E. Goodson
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305J. Heat Transfer. Oct 2008, 130(10): 102402 (7 pages)
Published Online: August 8, 2008
Article history
Received:
June 4, 2007
Revised:
January 11, 2008
Published:
August 8, 2008
Citation
Jain, A., and Goodson, K. E. (August 8, 2008). "Measurement of the Thermal Conductivity and Heat Capacity of Freestanding Shape Memory Thin Films Using the Method." ASME. J. Heat Transfer. October 2008; 130(10): 102402. https://doi.org/10.1115/1.2945904
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