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Limits to Critical Heat Flux Enhancement in a Liquid Film Falling Over a Structured Surface That Simulates a Microelectronic Chip
T. A. Grimley,
T. A. Grimley
School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907; Fluid and Thermal Systems Group, Southwest Research Institute, San Antonio, TX 78284
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I. Mudawwar,
I. Mudawwar
School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
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F. P. Incropera
F. P. Incropera
School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
Search for other works by this author on:
T. A. Grimley
School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907; Fluid and Thermal Systems Group, Southwest Research Institute, San Antonio, TX 78284
I. Mudawwar
School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
F. P. Incropera
School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
J. Heat Transfer. May 1988, 110(2): 535-538 (4 pages)
Published Online: May 1, 1988
Article history
Received:
May 6, 1987
Online:
October 20, 2009
Citation
Grimley, T. A., Mudawwar, I., and Incropera, F. P. (May 1, 1988). "Limits to Critical Heat Flux Enhancement in a Liquid Film Falling Over a Structured Surface That Simulates a Microelectronic Chip." ASME. J. Heat Transfer. May 1988; 110(2): 535–538. https://doi.org/10.1115/1.3250525
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