... ) 2 SO 3 ), iron chloride (FeCl 3 ), hydrochloric acid (HCl), and nitric acid (HNO 3 ). Scanning electron microscope (SEM) images exhibit quite clear rocky-wall-like structure. Grain boundaries are clearly observed. Each grain contains many subgrains and the average grain size is 10 μ m. Energy...

... parametric studies of practical interest are conducted to obtain mechanistic insights into various aspects of damage in solders e.g., effect of hydrostatic stresses, grain size, ramp rate, etc. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC...

...Sung Yi; Guangxing Luo; Kerm Sin Chian In the present study, a new constitutive model for eutectic solders (63Sn37Pb) is proposed. Grain sizes and phase sizes are considered as the coarsening is one of the main reasons for failure of solder joints. The present model has been developed based...

.... 20 October 1999 tin alloys lead alloys soldering creep viscoplasticity grain size free energy finite element analysis eutectic alloys The Pb-Sn eutectic alloy acts as both electrical and mechanical connection within and among the different surface mount packaging levels...