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Keywords: MIMIC
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044501.
Published Online: November 17, 2008
... interconnections MIMIC printed circuits strip lines coplanar transmission lines coplanar waveguide coplanar strip lines flip-chip devices packaging Traditionally, wire bonding has been used in monolithic microwave integrated circuit (MMIC) packaging. With this technique, the operation...
