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Journal Articles

Spray Cooling of IGBT Devices

Robert G. Mertens, Louis Chow, Kalpathy B. Sundaram, R. Brian Cregger, Daniel P. Rini, Louis Turek, Benjamin A. Saarloos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 316–323.
https://doi.org/10.1115/1.2753937
Published Online: May 18, 2007
View Article titled, Spray Cooling of IGBT Devices
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Topics: Cooling, Heat flux, Sprays, Temperature, Water, Junctions, Cycles
Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
https://doi.org/10.1115/1.2753908
Published Online: April 16, 2007
View Article titled, Flexible Profile Compact Thermal Models for Practical Geometries
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Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability
Journal Articles

Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS

Mehmet Arik, Anant Setlur, Stanton Weaver, Deborah Haitko, James Petroski
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 328–338.
https://doi.org/10.1115/1.2753958
Published Online: April 9, 2007
View Article titled, Chip to System Levels Thermal Needs and Alternative Thermal Technologies for High Brightness LEDS
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Topics: Brightness (Photometry), Design, Heat, Light-emitting diodes, Phosphors, Silicones, Temperature, Thermal management, Temperature distribution, Packaging
Journal Articles

Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors

Robert Wadell, Yogendra K. Joshi, Andrei G. Fedorov
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 291–299.
https://doi.org/10.1115/1.2753919
Published Online: March 28, 2007
View Article titled, Experimental Investigation of Compact Evaporators for Ultralow Temperature Refrigeration of Microprocessors
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Topics: Flow (Dynamics), Heat, Heat flux, Heat transfer, Refrigeration, Temperature, Pressure drop, Refrigerants, Microchannels
Journal Articles

Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact

Fang Liu, Guang Meng, Mei Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
https://doi.org/10.1115/1.2753910
Published Online: March 15, 2007
View Article titled, Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
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Topics: Damping, Deflection, Dynamics (Mechanics), Springs, Viscoelasticity, Viscosity, Dynamic analysis
Journal Articles

Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber

Yen-Shu Chen, Kuo-Hsiang Chien, Chi-Chuan Wang, Tzu-Chen Hung, Yuh-Ming Ferng, Bau-Shei Pei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 348–355.
https://doi.org/10.1115/1.2753970
Published Online: December 19, 2006
View Article titled, Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber
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Topics: Heat, Heat conduction, Plates (structures), Temperature, Temperature distribution, Thermal resistance, Vapors, Heat transfer, Flat heat pipes, Computer simulation
Journal Articles

Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink

X. L. Xie, W. Q. Tao, Y. L. He
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 247–255.
https://doi.org/10.1115/1.2753887
Published Online: December 13, 2006
View Article titled, Numerical Study of Turbulent Heat Transfer and Pressure Drop Characteristics in a Water-Cooled Minichannel Heat Sink
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Topics: Cooling, Heat flux, Heat sinks, Heat transfer, Pressure drop, Temperature, Thermal resistance, Turbulence, Wall thickness, Water
Journal Articles

Simulations of Process-Induced Warpage During IC Encapsulation Process

Shiang-Yu Teng, Sheng-Jye Hwang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 307–315.
https://doi.org/10.1115/1.2753936
Published Online: December 11, 2006
View Article titled, Simulations of Process-Induced Warpage During IC Encapsulation Process
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Topics: Shrinkage (Materials), Simulation, Warping, Temperature
Journal Articles

Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals

Luke M. Thompson, Michael R. Maughan, Karl K. Rink, Donald M. Blackketter, Robert R. Stephens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
https://doi.org/10.1115/1.2753920
Published Online: November 29, 2006
View Article titled, Thermal Induced Stresses in Bridge-Wire Initiator Glass-to-Metal Seals
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Topics: Finite element analysis, Glass, Stress, Wire, Manufacturing, Bridges (Structures), Cooling, Temperature
Journal Articles

Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects

Russell Whitenack, Chandra Desai, Mostafa Rassaian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 356–365.
https://doi.org/10.1115/1.2753981
Published Online: November 13, 2006
View Article titled, Parametric and Optimal Design in Electronic Packaging Using DSC: Computational, Geometrical, and Material Aspects
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Topics: Cycles, Design, Electronic packaging, Failure, Plasticity, Shapes, Solders
Journal Articles

Numerical Optimization of the Thermoelectric Cooling Devices

Boris Abramzon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 339–347.
https://doi.org/10.1115/1.2753959
Published Online: November 5, 2006
View Article titled, Numerical Optimization of the Thermoelectric Cooling Devices
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Topics: Cooling, Optimization, Temperature, Thermoelectric coolers, Electric current
Journal Articles

Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins

D. H. Lee, Y. S. Chung, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 221–228.
https://doi.org/10.1115/1.2753884
Published Online: October 30, 2006
View Article titled, Jet Impingement Cooling of Chips Equipped With Multiple Cylindrical Pedestal Fins
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Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number
Journal Articles

Effect of RCC on the Reliability of Adhesive Flip Chip Joints

Laura K. Frisk, Kati H. Kokko
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 260–265.
https://doi.org/10.1115/1.2753909
Published Online: October 27, 2006
View Article titled, Effect of RCC on the Reliability of Adhesive Flip Chip Joints
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Topics: Adhesives, Bonding, Flip-chip, Flip-chip devices, Particulate matter, Pressure, Reliability, Temperature, Failure, Delamination
Journal Articles

Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages

S. Radhakrishnan, G. Subbarayan, L. Nguyen, W. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 229–235.
https://doi.org/10.1115/1.2753885
Published Online: October 22, 2006
View Article titled, Stochastic Characterization and Models to Predict Performance Uncertainty in Photonic Packages
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Topics: Epoxy adhesives, Epoxy resins, Uncertainty, Viscoelasticity, Temperature, Modeling, Lasers, Displacement
Journal Articles

Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation

Leila Jannesari Ladani, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
https://doi.org/10.1115/1.2753911
Published Online: September 8, 2006
View Article titled, Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
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Topics: Ball-Grid-Array packaging, Creep, Damage, Durability, Finite element analysis, Modeling, Solders, Thermomechanics, Reliability, Solder joints
Journal Articles

A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results

Giulio Lorenzini, Simone Moretti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 324–327.
https://doi.org/10.1115/1.2756852
Published Online: August 31, 2006
View Article titled, A CFD Application to Optimize T-Shaped Fins: Comparisons to the Constructal Theory’s Results
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Topics: Computational fluid dynamics, Fins, Heat
Journal Articles

On-Wafer Capacitors Under Mechanical Stress

Päivi H. Karjalainen, Pekka Heino
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 287–290.
https://doi.org/10.1115/1.2753918
Published Online: August 24, 2006
View Article titled, On-Wafer Capacitors Under Mechanical Stress
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Topics: Capacitors, Semiconductor wafers, Stress, Complementary metal oxide semiconductors
Journal Articles

Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors

Brent L. Weight, Christopher A. Mattson, Spencer P. Magleby, Larry L. Howell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 236–246.
https://doi.org/10.1115/1.2721080
Published Online: July 25, 2006
View Article titled, Configuration Selection, Modeling, and Preliminary Testing in Support of Constant Force Electrical Connectors
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Topics: Design, Engineering prototypes, Modeling, Optimization, Testing, Displacement, Manufacturing, Deflection, Wear
Journal Articles

Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder

Gang Chen, Xu Chen, Kwang Soo Kim, Mohammad Abdel-Karim, Masao Sakane
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 278–286.
https://doi.org/10.1115/1.2753917
Published Online: July 20, 2006
View Article titled, Strain Rate Dependent Constitutive Model of Multiaxial Ratchetting of 63Sn–37Pb Solder
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Topics: Constitutive equations, Hardening, Kinematics, Shear (Mechanics), Solders, Stress, Deformation
Journal Articles

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

Duckjong Kim, Sung Jin Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 247–255.
https://doi.org/10.1115/1.1756149
Published Online: July 8, 2004
View Article titled, Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks
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Topics: Flow (Dynamics), Fluid dynamics, Heat sinks, Heat transfer, Modeling, Porous materials, Temperature distribution, Permeability, Pressure drop