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Journal Articles

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031005.
Paper No: EP-18-1076
https://doi.org/10.1115/1.4042982
Published Online: April 10, 2019
View Article titled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
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Topics: Light-emitting diodes, Particulate matter, Phosphors, Silicones, Packaging, Wetting, Surface energy
Journal Articles

Gold-Tin Solder Wetting Behavior for Package Lid Seals

Paul T. Vianco, Alice C. Kilgo, Bonnie M. McKenzie
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021003.
Paper No: EP-17-1115
https://doi.org/10.1115/1.4039749
Published Online: May 9, 2018
View Article titled, Gold-Tin Solder Wetting Behavior for Package Lid Seals
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Topics: Solders, Tin, Ceramics, Wetting, Contamination, Solder joints
Journal Articles

Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers

Byung-Seung Yim, Young-Eui Shin, Jong-Min Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041007.
Paper No: EP-17-1007
https://doi.org/10.1115/1.4038028
Published Online: October 13, 2017
View Article titled, Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
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Topics: Ball-Grid-Array packaging, Composite materials, Fillers (Materials), Solders, Wetting, Polymers, Melting, Statistical process control, Flow (Dynamics)
Journal Articles

Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions

Sheikh Mohammad Shavik, Mohammad Nasim Hasan, A. K. M. Monjur Morshed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010904.
Paper No: EP-15-1086
https://doi.org/10.1115/1.4032463
Published Online: March 10, 2016
View Article titled, Molecular Dynamics Study on Explosive Boiling of Thin Liquid Argon Film on Nanostructured Surface Under Different Wetting Conditions
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Topics: Boiling, Explosives, Molecular dynamics, Simulation, Temperature, Vapors, Wetting, Density, Equilibrium (Physics), Heat flux
Journal Articles

Durability of Low Melt Alloys as Thermal Interface Materials

Chandan K. Roy, Sushil Bhavnani, Michael C. Hamilton, R. Wayne Johnson, Roy W. Knight, Daniel K. Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010913.
Paper No: EP-15-1108
https://doi.org/10.1115/1.4032462
Published Online: March 10, 2016
View Article titled, Durability of Low Melt Alloys as Thermal Interface Materials
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Topics: Alloys, Thermal resistance, Disks, Copper, Wetting, Reliability, Cycles
Journal Articles

Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly

Ming Kong, Sungeun Jeon, Chiwon Hwang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021002.
https://doi.org/10.1115/1.4006513
Published Online: June 11, 2012
View Article titled, Influences of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronic Devices Assembly
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Topics: Manufacturing, Optoelectronic devices, Solders, Wetting, Modeling, Vehicles
Journal Articles

Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials

Lin Hu, William Evans, Pawel Keblinski
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
https://doi.org/10.1115/1.4003865
Published Online: June 22, 2011
View Article titled, Thermal Transport in Self-Assembled Conductive Networks for Thermal Interface Materials
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Topics: Composite materials, Nanoparticles, Particulate matter, Simulation, Thermal conductivity, Wetting, Self-assembly, Molecular dynamics simulation
Journal Articles

Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates

K. N. Prabhu, G. Kumar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
https://doi.org/10.1115/1.4002899
Published Online: November 19, 2010
View Article titled, Determination of Spread Activation Energy and Assessment of Wetting Behavior of Solders on Metallic Substrates
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Topics: Solders, Surface roughness, Tin, Wetting, Relaxation (Physics)
Journal Articles

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Sangil Lee, M. J. Yim, Daniel Baldwin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
https://doi.org/10.1115/1.3153369
Published Online: July 31, 2009
View Article titled, Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill
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Topics: Flip-chip devices, Flow (Dynamics), Solders, Hardening (Curing), Chemical reactions, Wetting, Temperature, Flip-chip, Manufacturing
Journal Articles

Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices

Li Ming Yu, Bang Han Sur, Kim Young Pyo, Wang Chun Qing, Zhang Lei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 22–25.
https://doi.org/10.1115/1.1646421
Published Online: April 30, 2004
View Article titled, Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices
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Topics: Solder joints, Solders, Surface tension, Wetting
Journal Articles

Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces

L. L. Meekisho, Mem. ASME,, K. Nelson-Owusu, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 52–56.
https://doi.org/10.1115/1.1646429
Published Online: April 30, 2004
View Article titled, Optimum Gullwing Fillet Solder Joint Under Thermomechanical Forces
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Topics: Solder joints, Solders, Stress, Surface tension, Thermomechanics, Wetting, Geometry, Shapes, Reliability, Finite element analysis
Journal Articles

Open Defects in PBGA Assembly Solder Joints

S. H. Fan, Y. C. Chan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
https://doi.org/10.1115/1.1536951
Published Online: March 14, 2003
View Article titled, Open Defects in PBGA Assembly Solder Joints
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Topics: Manufacturing, Solder joints, Solders, Soldering, Inspection, Thermal stability, Wetting, Printing
Journal Articles

Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves

D. Josell, W. E. Wallace, J. A. Warren, D. Wheeler, A. C. Powell, IV
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 227–233.
https://doi.org/10.1115/1.1463732
Published Online: July 26, 2002
View Article titled, Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves
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Topics: Displacement, Flip-chip, Modeling, Shear (Mechanics), Solder joints, Solders, Wetting, Geometry, Copper
Journal Articles

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

X. Wu, X. Dou, C.-P. Yeh, K. Waytt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 141–144.
https://doi.org/10.1115/1.2792601
Published Online: June 1, 1998
View Article titled, Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow
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Topics: Simulation, Solder joints, Solders, Geometry, Engineering simulation, Failure, Reliability, Wetting, Alloys, Computer simulation
Journal Articles

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 118–122.
https://doi.org/10.1115/1.2792592
Published Online: June 1, 1998
View Article titled, CBGA Solder Fillet Shape Prediction and Design Optimization
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Topics: Design, Optimization, Shapes, Solders, Reliability, Fatigue life, Ball-Grid-Array packaging, Ceramics, Composite materials, Engineering simulation
Journal Articles

Experimental Investigation of the Formation of Surface Mount Solder Joints

P. P. Conway, M. R. Kalantary, D. J. Williams
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 223–228.
https://doi.org/10.1115/1.2792156
Published Online: December 1, 1996
View Article titled, Experimental Investigation of the Formation of Surface Mount Solder Joints
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Topics: Solder joints, Surface mount packaging, Solders, Computers, Manufacturing, Microscopy, Process design, Reflow soldering, Temperature, Wetting
Journal Articles

Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver

D. C. Whalley, P. P. Conway
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 134–141.
https://doi.org/10.1115/1.2792143
Published Online: September 1, 1996
View Article titled, Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver
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Topics: Simulation, Wetting, Solders, Surface tension, Electromagnetic scattering, Errors, Modeling, Shapes, Solder joints, Soldering
Journal Articles

Dynamic Aspects of Wetting Balance Tests

K. W. Moon, W. J. Boettinger, M. E. Williams, D. Josell, B. T. Murray, W. C. Carter, C. A. Handwerker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 174–183.
https://doi.org/10.1115/1.2792149
Published Online: September 1, 1996
View Article titled, Dynamic Aspects of Wetting Balance Tests
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Topics: Wetting, Plates (structures), Fluids, Glass, Shapes, Solders, Computer software, Equilibrium (Physics), Flow (Dynamics), Shear stress
Journal Articles

Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor

J. Campbell, H. Conrad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 241–245.
https://doi.org/10.1115/1.2792099
Published Online: September 1, 1995
View Article titled, Wetting Kinetics of Molten 60Sn40Pb on a Ag-0.33 wt.% Pt Thick Film Conductor
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Topics: Thick films, Wetting, Temperature, Tin, Alloys, Atoms, Diffusion (Physics), Intermetallic compounds, Solders
Journal Articles

Undercooling of 63SN-37PB Solder Pastes

Zequn Mei
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 105–108.
https://doi.org/10.1115/1.2792075
Published Online: June 1, 1995
View Article titled, Undercooling of 63SN-37PB Solder Pastes
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Topics: Solders, Supercooling, Aluminum, Cooling, Copper, Solidification, Wetting, Manufacturing, Nucleation (Physics), Solder joints