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Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020904.
Paper No: EP-20-1119
https://doi.org/10.1115/1.4049928
Published Online: March 5, 2021
View Article titled, Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
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Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)
Journal Articles

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

C. Falsetti, M. Magnini, J. R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031008.
Paper No: EP-17-1023
https://doi.org/10.1115/1.4037152
Published Online: July 10, 2017
View Article titled, Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator
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Topics: Boiling, Flow (Dynamics), Heat flux, Heat transfer, Heat transfer coefficients, Pressure drop, Temperature, Vapors, Fins, Heat
Journal Articles

Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization

Houxue Huang, Navid Borhani, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031004.
Paper No: EP-16-1037
https://doi.org/10.1115/1.4033487
Published Online: May 17, 2016
View Article titled, Thermal Response of Multi-Microchannel Evaporators During Flow Boiling of Refrigerants Under Transient Heat Loads With Flow Visualization
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Topics: Boiling, Flow (Dynamics), Fluids, Heat, Heat flux, Microchannels, Stress, Temperature, Transients (Dynamics), Subcooling
Journal Articles

Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation

Nicolas Lamaison, Jackson Braz Marcinichen, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2013, 135(3): 030908.
Paper No: EP-12-1088
https://doi.org/10.1115/1.4024590
Published Online: July 24, 2013
View Article titled, Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation
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Topics: Cooling, Flow (Dynamics), Heat, Simulation, Transients (Dynamics), Vapors, Two-phase flow, Temperature, Pipes, Steady state
Journal Articles

Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement

M. K. Abdullah, M. Z. Abdullah, M. A. Mujeebu, Horizon Gitano, Z. M. Ariff, R. Razali, K. A. Ahmad
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
https://doi.org/10.1115/1.4000719
Published Online: March 4, 2010
View Article titled, Three-Dimensional Modeling of Mold Filling in Microchip Encapsulation Process With a Matrix-Array Arrangement
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Topics: Cavities, Computer simulation, Epoxy adhesives, Epoxy resins, Finite difference methods, Flow (Dynamics), Integrated circuits, Molding, Pressure, Simulation
Journal Articles

Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks

Jaeseon Lee, Issam Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031008.
https://doi.org/10.1115/1.3144146
Published Online: July 2, 2009
View Article titled, Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks
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Topics: Boiling, Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Subcooling, Temperature, Two-phase flow
Journal Articles

Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-Fins

Christopher A. Konishi, Weilin Qu, Frank E. Pfefferkorn
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021010.
https://doi.org/10.1115/1.3104028
Published Online: April 3, 2009
View Article titled, Experimental Study of Water Liquid-Vapor Two-Phase Pressure Drop Across an Array of Staggered Micropin-Fins
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Topics: Fins, Flow (Dynamics), Pressure drop, Vapors, Water, Friction, Two-phase flow
Journal Articles

Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System

Cheng-Wei Tien, Kun-Huang Yu, Wen-Junn Sheu, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024501.
https://doi.org/10.1115/1.3103940
Published Online: March 27, 2009
View Article titled, Effect of Variable Heating Load on the Refrigerant Distribution of a Dual Cold-Plate System
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Topics: Heating, Plates (structures), Refrigerants, Stress, Cooling, Vapors, Superheating, Two-phase flow, Pressure drop, Pressure
Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
View Article titled, Editorial
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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

Two-Phase Flow and Heat Transfer in Rectangular Micro-Channels

Weilin Qu, Graduate Research Assistant, Student Mem. ASME, Seok-Mann Yoon, Postdoctoral Research Associate, Issam Mudawar, Professor and Director, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 288–300.
https://doi.org/10.1115/1.1756589
Published Online: October 6, 2004
View Article titled, Two-Phase Flow and Heat Transfer in Rectangular Micro-Channels
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Topics: Boiling, Flow (Dynamics), Microchannels, Two-phase flow, Heat sinks, Heat transfer, Water
Journal Articles

Transport Phenomena in Two-Phase Micro-Channel Heat Sinks

Weilin Qu, Graduate Research Assistant, Student Mem. ASME, Issam Mudawar, Professor, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 213–224.
https://doi.org/10.1115/1.1756145
Published Online: July 8, 2004
View Article titled, Transport Phenomena in Two-Phase Micro-Channel Heat Sinks
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Topics: Boiling, Flow (Dynamics), Heat sinks, Microchannels, Pressure drop, Two-phase flow, Heat transfer, Water, Temperature, Hydrodynamic stability