1-20 of 27
Multi-chip modules
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041101.
Paper No: EP-24-1006
https://doi.org/10.1115/1.4065446
Published Online: May 24, 2024
View Article titled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
Open the PDF for Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module in another window
Topics: Computer simulation, Cooling, Flow (Dynamics), Heat, Heat sinks, Multi-chip modules, Pressure drop, Temperature, Fluids, Coolants
Journal Articles

Flexible Profile Compact Thermal Models for Practical Geometries

Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 256–259.
https://doi.org/10.1115/1.2753908
Published Online: April 16, 2007
View Article titled, Flexible Profile Compact Thermal Models for Practical Geometries
Open the PDF for Flexible Profile Compact Thermal Models for Practical Geometries in another window
Topics: Boundary-value problems, Errors, Heat, Heat flux, Heating, Temperature, Temperature gradient, Integrated circuit packaging, Multi-chip modules, Reliability
Journal Articles

Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement

Y. C. Lee, C. J. Fang, M. C. Wu, C. H. Peng, Y. H. Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
https://doi.org/10.1115/1.2804089
Published Online: January 25, 2007
View Article titled, Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
Open the PDF for Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement in another window
Topics: Design, Disks, Heat transfer, Multi-chip modules, Nozzles, Optimization, Reynolds number, Sensitivity analysis
Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
https://doi.org/10.1115/1.1827263
Published Online: January 24, 2005
View Article titled, Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
Open the PDF for Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices in another window
Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
View Article titled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
Open the PDF for On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules in another window
Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection
Journal Articles

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

Shiva P. Gadag, Susan K. Patra, Volkan Ozguz, Phillipe Marchand, Sadik Esener
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
https://doi.org/10.1115/1.1481894
Published Online: July 26, 2002
View Article titled, Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
Open the PDF for Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor in another window
Topics: Cables, Ceramics, Composite materials, Convection, Cooling, Design, Finite element analysis, Finite element model, Heat, Heat sinks
Journal Articles

Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 233–239.
https://doi.org/10.1115/1.1287928
Published Online: September 1, 2000
View Article titled, Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
Open the PDF for Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution in another window
Topics: Boundary-value problems, Cavities, Electronic packages, Fourier series, Multi-chip modules, Temperature, Thermal characterization, Laplace equations, Modeling, Junctions
Journal Articles

Thermal Placement Design for MCM Applications

Yu-Jung Huang, Shen-Li Fu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 115–120.
https://doi.org/10.1115/1.483142
Published Online: November 9, 1999
View Article titled, Thermal Placement Design for MCM Applications
Open the PDF for Thermal Placement Design for MCM Applications in another window
Topics: Algorithms, Design, Energy dissipation, Finite element analysis, Multi-chip modules, Simulation results, Reliability, Heat, Thermal management, Temperature distribution
Journal Articles

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Q. Yao, J. Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 196–201.
https://doi.org/10.1115/1.2792684
Published Online: September 1, 1999
View Article titled, Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages
Open the PDF for Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages in another window
Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect
Journal Articles

The Effects of Material Properties on Heat Dissipation in High Power Electronics

T. J. Lu, A. G. Evans, J. W. Hutchinson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 280–289.
https://doi.org/10.1115/1.2792634
Published Online: September 1, 1998
View Article titled, The Effects of Material Properties on Heat Dissipation in High Power Electronics
Open the PDF for The Effects of Material Properties on Heat Dissipation in High Power Electronics in another window
Topics: Electronics, Energy dissipation, Heat, Materials properties, Thermal conductivity, Cooling, Approximation, Diamonds, Dimensions, Insulation
Journal Articles

Development of a Two Matrix Model for Thermal Analysis of a Multichip Module

M. A. Butterbaugh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1997, 119(4): 288–293.
https://doi.org/10.1115/1.2792251
Published Online: December 1, 1997
View Article titled, Development of a Two Matrix Model for Thermal Analysis of a Multichip Module
Open the PDF for Development of a Two Matrix Model for Thermal Analysis of a Multichip Module in another window
Topics: Multi-chip modules, Thermal analysis, Temperature, Computer simulation, Design, Thermal resistance
Journal Articles

Micro Heat Exchangers Consisting of Pin Arrays

Xiaoqing Yin, H. H. Bau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 51–57.
https://doi.org/10.1115/1.2792200
Published Online: March 1, 1997
View Article titled, Micro Heat Exchangers Consisting of Pin Arrays
Open the PDF for Micro Heat Exchangers Consisting of Pin Arrays in another window
Topics: Heat exchangers, Heat, Computer simulation, Coolants, Flow (Dynamics), Geometry, High temperature superconductors, Multi-chip modules, Nitrogen, Semiconductor wafers
Journal Articles

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

D. Pal, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
https://doi.org/10.1115/1.2792199
Published Online: March 1, 1997
View Article titled, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
Open the PDF for Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study in another window
Topics: Phase change materials, Laminates, Transients (Dynamics), Computation, Computer simulation, Cooling, Cooling systems, Density, Dimensions, Enthalpy
Journal Articles

An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects

K. X. Hu, C. P. Yeh, X. S. Wu, K. Wyatt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 206–213.
https://doi.org/10.1115/1.2792154
Published Online: December 1, 1996
View Article titled, An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects
Open the PDF for An Interfacial Delamination Analysis for Multichip Module Thin Film Interconnects in another window
Topics: Delamination, Multi-chip modules, Thin films, Stress, Finite element analysis, Fracture (Materials), Polymers, Relaxation (Physics), Reliability
Journal Articles

Controlling the Dimensions of Laser Chemical Vapor Deposited Metallurgy

L. Economikos, D. E. Kotecki, R. Surprenant
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1996, 118(1): 7–10.
https://doi.org/10.1115/1.2792126
Published Online: March 1, 1996
View Article titled, Controlling the Dimensions of Laser Chemical Vapor Deposited Metallurgy
Open the PDF for Controlling the Dimensions of Laser Chemical Vapor Deposited Metallurgy in another window
Topics: Dimensions, Lasers, Metallurgy, Vapors, Metals, Microchannels, Chemical vapor deposition, Circuits, Density, Finite element model
Journal Articles

Chip on Board: Technologies for Multichip Modules

John H. Lau, Editor, Richard J. Prosman, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1995, 117(2): 165.
https://doi.org/10.1115/1.2792085
Published Online: June 1, 1995
View Article titled, Chip on Board: Technologies for Multichip Modules
Open the PDF for Chip on Board: Technologies for Multichip Modules in another window
Topics: Multi-chip modules
Journal Articles

On Murphy’s Integrated Circuit Yield Integral

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 159–164.
https://doi.org/10.1115/1.2792084
Published Online: June 1, 1995
View Article titled, On Murphy’s Integrated Circuit Yield Integral
Open the PDF for On Murphy’s Integrated Circuit Yield Integral in another window
Topics: Integrated circuits, Multi-chip modules, Density, Semiconductor wafers
Journal Articles

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 148–153.
https://doi.org/10.1115/1.2905503
Published Online: June 1, 1994
View Article titled, Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic
Open the PDF for Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic in another window
Topics: Ceramics, Low temperature, Thermomechanics, Temperature, Bending strength, Design, Elastic moduli, Electronic packages, Fracture toughness, Materials properties
Journal Articles

Optimization of Extruded Type External Heat Sink for Multichip Module

A. Mertol
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1993, 115(4): 440–444.
https://doi.org/10.1115/1.2909354
Published Online: December 1, 1993
View Article titled, Optimization of Extruded Type External Heat Sink for Multichip Module
Open the PDF for Optimization of Extruded Type External Heat Sink for Multichip Module in another window
Topics: Heat sinks, Multi-chip modules, Optimization, Junctions, Dimensions, Temperature, Air flow, Design, Finite element analysis, Finite element model
Journal Articles

Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling

C. O. Gersey, I. Mudawar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 78–88.
https://doi.org/10.1115/1.2909305
Published Online: March 1, 1993
View Article titled, Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling
Open the PDF for Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling in another window
Topics: Boiling, Critical heat flux, Flow (Dynamics), Nucleate boiling, Subcooling, Heat transfer coefficients, Coolants, Forced convection, Multi-chip modules