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Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

A. Bar-Cohen, J. J. Maurer, D. H. Altman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040803.
Paper No: EP-18-1067
https://doi.org/10.1115/1.4043404
Published Online: July 30, 2019
View Article titled, Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management
Journal Articles

Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling

Gunjan Agarwal, Thomas Kazior, Thomas Kenny, Dana Weinstein
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011001.
Paper No: EP-16-1073
https://doi.org/10.1115/1.4035064
Published Online: November 10, 2016
View Article titled, Modeling and Analysis for Thermal Management in Gallium Nitride HEMTs Using Microfluidic Cooling
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Topics: Cooling, Flow (Dynamics), Fluids, Gallium nitride, Microchannels, Microfluidics, Silicon, Temperature, Heat, Geometry
Journal Articles

Modular Microfluidic Filters Based on Transparent Membranes

E. Archibong, H. Tuazon, H. Wang, J. Winskas, A. L. Pyayt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041002.
Paper No: EP-16-1049
https://doi.org/10.1115/1.4034369
Published Online: August 19, 2016
View Article titled, Modular Microfluidic Filters Based on Transparent Membranes
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Topics: Filters, Filtration, Membranes, Microfluidics, Particulate matter, Transparency, Manufacturing, Microparticles
Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010910.
Paper No: EP-15-1107
https://doi.org/10.1115/1.4032496
Published Online: March 10, 2016
View Article titled, Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing
Journal Articles

Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate

Outmane Lemtiri Chlieh, Wasif T. Khan, John Papapolymerou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031009.
Paper No: EP-14-1104
https://doi.org/10.1115/1.4030643
Published Online: September 1, 2015
View Article titled, Thermal Modeling of Microfluidic Channels for Cooling High Power Resistors on Multilayer Organic Liquid Crystal Polymer Substrate
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Topics: Cooling, Flow (Dynamics), Heat, Manufacturing, Microchannels, Microfluidics, Resistors, Temperature, Thermal resistance, Water
Journal Articles

Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap

Xuefei Han, Yogendra K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011008.
Paper No: EP-13-1083
https://doi.org/10.1115/1.4028574
Published Online: October 15, 2014
View Article titled, Compact Model-Based Microfluidic Controller for Energy Efficient Thermal Management Using Single Tier and Three-Dimensional Stacked Pin-Fin Enhanced Microgap
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Topics: Computational fluid dynamics, Control equipment, Flow (Dynamics), Fluids, Heat, Modeling, Temperature, Thermal management, Microfluidics
Journal Articles

An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems

Kazuyoshi Fushinobu, Masashi Nakata
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 141–146.
https://doi.org/10.1115/1.1869511
Published Online: August 9, 2004
View Article titled, An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems
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Topics: Electroosmosis, Flow (Dynamics), Manufacturing, Microchannels, Microelectromechanical systems, Microfluidics