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Journal Articles

Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures

Wenbo Zhu, Xiaoting Wang, Mingyu Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021006.
Paper No: EP-19-1070
https://doi.org/10.1115/1.4046341
Published Online: March 9, 2020
View Article titled, Low-Temperature Bonding of Cu Through Self-Propagating Reaction Under Various Temperatures and Pressures
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Topics: Bonding, Temperature, Temperature profiles, Tin, Solders, Low temperature, Pressure, Shear strength, Heat, Melting
Journal Articles

Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time

Pratik V. Bansode, Jimil M. Shah, Gautam Gupta, Dereje Agonafer, Harsh Patel, David Roe, Rick Tufty
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011010.
Paper No: EP-18-1094
https://doi.org/10.1115/1.4045156
Published Online: November 8, 2019
View Article titled, Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time
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Topics: Fluids, Pumps, Temperature, Thermocouples, Low temperature, Energy consumption
Journal Articles

Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste

Hao Cheng, Yang Peng, Yun Mou, Qinglei Sun, Mingxiang Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041003.
Paper No: EP-18-1070
https://doi.org/10.1115/1.4043645
Published Online: May 24, 2019
View Article titled, Low-Temperature Fabrication of Three-Dimensional Ceramic Substrate by Molding Inorganic Aluminosilicate Paste
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Topics: Cements (Adhesives), Ceramics, Dams, Manufacturing, Reliability, Shear strength, Low temperature, Molding, Temperature, Viscosity
Journal Articles

Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review

Asisa Kumar Panigrahy, Kuan-Neng Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2018, 140(1): 010801.
Paper No: EP-17-1076
https://doi.org/10.1115/1.4038392
Published Online: March 2, 2018
View Article titled, Low Temperature Cu–Cu Bonding Technology in Three-Dimensional Integration: An Extensive Review
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Topics: Bonding, Low temperature
Journal Articles

High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux

Fuliang Wang, Junhui Li, Lei Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031001.
Paper No: EP-12-1083
https://doi.org/10.1115/1.4026877
Published Online: May 5, 2014
View Article titled, High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux
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Topics: Bonding, Low temperature, Silver
Journal Articles

Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art

Dapeng Liu, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. March 2014, 136(1): 014001.
Paper No: EP-13-1038
https://doi.org/10.1115/1.4026615
Published Online: February 18, 2014
View Article titled, Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art
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Topics: Bonding, Manufacturing, Semiconductor wafers, Solders, Packaging, Low temperature
Journal Articles

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Yuan-Yun Wu, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011006.
Paper No: EP-13-1063
https://doi.org/10.1115/1.4026171
Published Online: January 8, 2014
View Article titled, The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes
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Topics: Alloys, Bonding, Copper, Design, High temperature, Low temperature, Shear (Mechanics), Silver, Solid solutions, Temperature
Journal Articles

Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures

Jung-Il Hong, Yong Ding, Kyoung-Sik Moon, C. P. Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011002.
Paper No: EP-11-1101
https://doi.org/10.1115/1.4023910
Published Online: March 26, 2013
View Article titled, Enhanced Diffusion of Silver Atoms on the Surface of Nanoparticles at Low Temperatures
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Topics: Atoms, Diffusion (Physics), Low temperature, Nanoparticles, Silver, Temperature
Journal Articles

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
https://doi.org/10.1115/1.4003868
Published Online: June 22, 2011
View Article titled, Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates
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Topics: Bonding, Silicon chips, Pressure, Shear (Mechanics), Silicon, Thermal expansion, Low temperature, Temperature
Journal Articles

The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method

Wen-Ren Jong, Hsin-Chun Tsai, Hsiu-Tao Chang, Shu-Hui Peng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011001.
https://doi.org/10.1115/1.2837508
Published Online: January 31, 2008
View Article titled, The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
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Topics: Creep, Lead-free solders, Semiconductor wafers, Shear (Mechanics), Solder joints, Taguchi methods, Temperature, Solders, Low temperature
Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
https://doi.org/10.1115/1.1648057
Published Online: July 8, 2004
View Article titled, Characterization of Substrate Materials for System-in-a-Package Applications
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Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion
Journal Articles

Hygrothermal Cracking Analysis of Plastic IC Package

Ji Hyuck Yang, Kang Yong Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
https://doi.org/10.1115/1.1870016
Published Online: June 8, 2004
View Article titled, Hygrothermal Cracking Analysis of Plastic IC Package
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Topics: Delamination, Fracture (Materials), Fracture (Process), Fracture mechanics, High temperature, Reflow soldering, Vapor pressure, Viscoelasticity, Low temperature, Design
Journal Articles

Impact of Low Temperatures on Solder Joint Failures

Boris Mirman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2002, 124(2): 135–137.
https://doi.org/10.1115/1.1465431
Published Online: May 2, 2002
View Article titled, Impact of Low Temperatures on Solder Joint Failures
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Topics: Failure, Low temperature, Solder joints, Solders, Stress, Shear (Mechanics), Circuits
Journal Articles

Die Attachment for −120°C to +20°C Thermal Cycling of Microelectronics for Future Mars Rovers—An Overview

Randall K. Kirschman, Witold M. Sokolowski, Elizabeth A. Kolawa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 105–111.
https://doi.org/10.1115/1.1347996
Published Online: October 20, 2000
View Article titled, Die Attachment for −120°C to +20°C Thermal Cycling of Microelectronics for Future Mars Rovers—An Overview
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Topics: Electronics, Low temperature, Temperature, Cycles, Solders, Adhesives
Journal Articles

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

T.-Y. Tom Lee, R. Sharma, A. Peyre-Lavigne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 135–140.
https://doi.org/10.1115/1.2792599
Published Online: June 1, 1998
View Article titled, Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool
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Topics: Carbon, Computational fluid dynamics, Design, Sensors, Steady state, Transients (Dynamics), Cooling, Cycles, Electrical measurement, Energy consumption
Journal Articles

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 148–153.
https://doi.org/10.1115/1.2905503
Published Online: June 1, 1994
View Article titled, Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic
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Topics: Ceramics, Low temperature, Thermomechanics, Temperature, Bending strength, Design, Elastic moduli, Electronic packages, Fracture toughness, Materials properties
Journal Articles

Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount Assembly

J. Seyyedi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 305–311.
https://doi.org/10.1115/1.2909333
Published Online: September 1, 1993
View Article titled, Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount Assembly
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Topics: Alloys, Fatigue, Low temperature, Manufacturing, Solders, Bearings, Failure mechanisms, Fatigue testing, Solder joints
Journal Articles

Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections

M. M. Hou, Thomas W. Eagar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1992, 114(4): 443–447.
https://doi.org/10.1115/1.2905478
Published Online: December 1, 1992
View Article titled, Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections
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Topics: Bonding, Low temperature, Transients (Dynamics), Temperature, Tin, Copper, Fatigue, Solders, Aluminum, Diffusion bonding (Metals)
Journal Articles

Strains in Aluminum-Adhesive-Ceramic Trilayers

P. M. Hall, F. L. Howland, Y. S. Kim, L. H. Herring
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1990, 112(4): 288–302.
https://doi.org/10.1115/1.2904381
Published Online: December 1, 1990
View Article titled, Strains in Aluminum-Adhesive-Ceramic Trilayers
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Topics: Adhesives, Aluminum, Ceramics, Epoxy adhesives, Epoxy resins, Elastic moduli, Temperature, Dimensions, Elastomers, Heat
Journal Articles

High and Low Temperature Strain-Life Behavior of a Pb Rich Solder

H. D. Solomon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1990, 112(2): 123–128.
https://doi.org/10.1115/1.2904352
Published Online: June 1, 1990
View Article titled, High and Low Temperature Strain-Life Behavior of a Pb Rich Solder
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Topics: Low temperature, Solders, Fatigue, Fatigue life, Temperature