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Journal Articles

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Inderjot Kaur, Shiraz Mujahid, YubRaj Paudel, Hongjoo Rhee, Prashant Singh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031002.
Paper No: EP-22-1051
https://doi.org/10.1115/1.4056305
Published Online: December 21, 2022
View Article titled, Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
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Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Topology, Temperature
Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041011.
Paper No: EP-21-1119
https://doi.org/10.1115/1.4053310
Published Online: January 28, 2022
View Article titled, Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
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Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
https://doi.org/10.1115/1.4052465
Published Online: October 13, 2021
View Article titled, Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors
Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021105.
Paper No: EP-21-1012
https://doi.org/10.1115/1.4052071
Published Online: September 24, 2021
View Article titled, A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics
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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat
Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011003.
Paper No: EP-20-1083
https://doi.org/10.1115/1.4050696
Published Online: August 6, 2021
View Article titled, Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis
Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020904.
Paper No: EP-20-1119
https://doi.org/10.1115/1.4049928
Published Online: March 5, 2021
View Article titled, Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
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Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)
Journal Articles

Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets

Prabhakar Subrahmanyam, B. K. Gnanavel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031009.
Paper No: EP-20-1104
https://doi.org/10.1115/1.4049579
Published Online: February 19, 2021
View Article titled, Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets
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Topics: Flow (Dynamics), Heat transfer, Heat transfer coefficients, Jets, Nozzles, Reynolds-averaged Navier–Stokes equations, Silicon, Reynolds number, Turbulence, Temperature
Journal Articles

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Bharath Ramakrishnan, Yaser Hadad, Sami Alkharabsheh, Paul R. Chiarot, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041005.
Paper No: EP-18-1069
https://doi.org/10.1115/1.4044130
Published Online: July 12, 2019
View Article titled, Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers
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Topics: Computer simulation, Coolants, Cooling, Flow (Dynamics), Pressure drop, Temperature, Thermal resistance, Heat, Heat transfer coefficients, Heat transfer
Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031003.
Paper No: EP-17-1081
https://doi.org/10.1115/1.4039264
Published Online: May 11, 2018
View Article titled, Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
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Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels
Journal Articles

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020906.
Paper No: EP-18-1003
https://doi.org/10.1115/1.4040088
Published Online: May 9, 2018
View Article titled, Enhanced Heat Transfer Using Microporous Copper Inverse Opals
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Topics: Copper, Critical heat flux, Heat transfer, Pool boiling, Boiling, Heat transfer coefficients, Bubbles
Journal Articles

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

C. Falsetti, M. Magnini, J. R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031008.
Paper No: EP-17-1023
https://doi.org/10.1115/1.4037152
Published Online: July 10, 2017
View Article titled, Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator
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Topics: Boiling, Flow (Dynamics), Heat flux, Heat transfer, Heat transfer coefficients, Pressure drop, Temperature, Vapors, Fins, Heat
Journal Articles

Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling

Pablo A. de Oliveira, Jader R. Barbosa, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031005.
Paper No: EP-17-1008
https://doi.org/10.1115/1.4036817
Published Online: June 28, 2017
View Article titled, Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
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Topics: Compressors, Cooling, Heat, Heat sinks, Heat transfer, Refrigeration, Stress, Temperature, Flow (Dynamics), Refrigerants
Journal Articles

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Houxue Huang, Nicolas Lamaison, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011005.
Paper No: EP-16-1083
https://doi.org/10.1115/1.4035386
Published Online: January 5, 2017
View Article titled, Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance
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Topics: Boiling, Flow (Dynamics), Fluids, Heat conduction, Heat flux, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature
Journal Articles

Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

Xuefei Han, Andrei Fedorov, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2016, 138(4): 040801.
Paper No: EP-16-1013
https://doi.org/10.1115/1.4034317
Published Online: August 24, 2016
View Article titled, Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems
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Topics: Boiling, Flow (Dynamics), Heat flux, Water, Temperature, Pressure, Heat transfer coefficients, Heat sinks
Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010910.
Paper No: EP-15-1107
https://doi.org/10.1115/1.4032496
Published Online: March 10, 2016
View Article titled, Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications
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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing
Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010907.
Paper No: EP-15-1104
https://doi.org/10.1115/1.4032655
Published Online: March 10, 2016
View Article titled, Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices
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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation
Journal Articles

Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031015.
Paper No: EP-15-1041
https://doi.org/10.1115/1.4030953
Published Online: September 1, 2015
View Article titled, Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements
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Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Nozzles, Reynolds number, Jets, Temperature, Heat flux
Journal Articles

Thermal Management of Time-Varying High Heat Flux Electronic Devices

T. David, D. Mendler, A. Mosyak, A. Bar-Cohen, G. Hetsroni
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021003.
Paper No: EP-13-1064
https://doi.org/10.1115/1.4027325
Published Online: April 29, 2014
View Article titled, Thermal Management of Time-Varying High Heat Flux Electronic Devices
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Topics: Flow (Dynamics), Heat flux, Heat sinks, Microchannels, Temperature, Fluids, Steady state, Vapors, Wall temperature, Boiling
Journal Articles

Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution

Jun Jie Liu, Hua Zhang, S. C. Yao, Yubai Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021008.
Paper No: EP-13-1129
https://doi.org/10.1115/1.4027420
Published Online: April 29, 2014
View Article titled, Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution
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Topics: Boiling, Cooling, Flow (Dynamics), Heat flux, Heat transfer, Microchannels, Modeling, Porous materials, Pressure drop, Temperature