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Journal Articles

Convection Cooling of Power Electronics Operating in Deep-Space

Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041111.
Paper No: EP-24-1027
https://doi.org/10.1115/1.4065947
Published Online: August 9, 2024
View Article titled, Convection Cooling of Power Electronics Operating in Deep-Space
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Topics: Design, Electronics, Fans, Forced convection, Heat, Simulation, Temperature, Thermal management, Packaging, Cooling
Journal Articles

Recent Developments in Air Pumps for Thermal Management of Electronics

Tsrong-Yi Wen, Jia-Cheng Ye
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030802.
Paper No: EP-20-1109
https://doi.org/10.1115/1.4051970
Published Online: October 1, 2021
View Article titled, Recent Developments in Air Pumps for Thermal Management of Electronics
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Topics: Pumps, Flow (Dynamics), Diaphragms (Mechanical devices), Diaphragms (Structural), Fans, Electronics, Cooling
Journal Articles

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031004.
Paper No: EP-18-1075
https://doi.org/10.1115/1.4042983
Published Online: April 10, 2019
View Article titled, Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design
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Topics: Air flow, Cooling, Data centers, Design, Exhaust systems, Fans, Leakage, Pressure, Sensors, Temperature
Journal Articles

Effectiveness of Rack-Level Fans—Part I: Energy Savings Through Consolidation

Richard Eiland, John Edward Fernandes, Bharath Nagendran, Veerendra Mulay, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041011.
Paper No: EP-17-1021
https://doi.org/10.1115/1.4038235
Published Online: October 27, 2017
View Article titled, Effectiveness of Rack-Level Fans—Part I: Energy Savings Through Consolidation
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Topics: Fans, Temperature
Journal Articles

Effectiveness of Rack-Level Fans—Part II: Control Strategies and System Redundancy

John Edward Fernandes, Richard Eiland, Bharath Nagendran, Veerendra Mulay, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2017, 139(4): 041012.
Paper No: EP-17-1022
https://doi.org/10.1115/1.4038014
Published Online: October 27, 2017
View Article titled, Effectiveness of Rack-Level Fans—Part II: Control Strategies and System Redundancy
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Topics: Failure, Fans, Stress, Redundancy (Engineering), Cooling
Journal Articles

Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches

Jason Stafford, Florian Fortune
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011008.
Paper No: EP-13-1025
https://doi.org/10.1115/1.4026351
Published Online: January 24, 2014
View Article titled, Investigation of Multiple Miniature Axial Fan Cooling Solutions and Thermal Modeling Approaches
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Topics: Cooling, Design, Fans, Flow (Dynamics), Heat sinks, Heat transfer, Thermal resistance, Computer simulation, Modeling, Air flow
Journal Articles

Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation

Dustin W. Demetriou, H. Ezzat Khalifa
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020904.
https://doi.org/10.1115/1.4005907
Published Online: June 11, 2012
View Article titled, Optimization of Enclosed Aisle Data Centers Using Bypass Recirculation
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Topics: Computational fluid dynamics, Cooling, Data centers, Energy consumption, Flow (Dynamics), Optimization, Temperature, Tiles, Refrigeration, Fans
Journal Articles

Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens

R. Antón, A. Bengoechea, A. Rivas, J. C. Ramos, G. S. Larraona
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011004.
https://doi.org/10.1115/1.4005913
Published Online: March 19, 2012
View Article titled, Performance of Axial Fans in Close Proximity to the Electromagnetic Compatibility Screens
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Topics: Fans, Flow (Dynamics), Porosity, Pressure, Electromagnetic compatibility, Air flow
Journal Articles

Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation

Patrick A. Walsh, Edmond J. Walsh, Ronan Grimes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021001.
https://doi.org/10.1115/1.4001590
Published Online: May 19, 2010
View Article titled, Viscous Scaling Phenomena in Miniature Centrifugal Flow Cooling Fans: Theory, Experiments and Correlation
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Topics: Blades, Chords (Trusses), Fans, Flow (Dynamics), Pressure, Scaling laws (Mathematical physics), Cooling, Reynolds number, Design
Journal Articles

Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

V. Egan, P. A. Walsh, E. Walsh, R. Grimes
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031004.
https://doi.org/10.1115/1.3144150
Published Online: June 23, 2009
View Article titled, Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins
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Topics: Design, Flow (Dynamics), Heat sinks, Cooling, Thermal resistance, Fans, Fins
Journal Articles

Modeling Electronic Cooling Axial Fan Flows

R. Grimes, M. Davies, J. Punch, T. Dalton, R. Cole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 112–119.
https://doi.org/10.1115/1.1339821
Published Online: October 2, 2000
View Article titled, Modeling Electronic Cooling Axial Fan Flows
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Topics: Fans, Flow (Dynamics), Pressure, Computational fluid dynamics, Cooling, Modeling
Journal Articles

Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates

E. B. Zimmerman, H. Hegab, G. T. Colwell
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 50–54.
https://doi.org/10.1115/1.2792661
Published Online: March 1, 1999
View Article titled, Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates
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Topics: Axial flow, Cold climates, Computer simulation, Containers, Convection, Cooling, Cooling systems, Electronics, Fans, Flow (Dynamics)