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Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
View Article titled, Editorial
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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling

Peter J. Rodgers, Vale´rie C. Eveloy, Mark R. D. Davies
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 67–75.
https://doi.org/10.1115/1.1533059
Published Online: March 14, 2003
View Article titled, An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling
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Topics: Computational fluid dynamics, Computer simulation, Flow (Dynamics), Forced convection, Heat transfer, Junctions, Modeling, Temperature, Electronic components, Printed circuit boards
Journal Articles

Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications

Y. Guo, S. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 186–193.
https://doi.org/10.1115/1.2792619
Published Online: June 1, 1998
View Article titled, Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications
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Topics: Electronic packaging, Event history analysis, Stress, Reliability, Failure, Packaging, Cycles, Design, Electronic packages, Electronic products
Journal Articles

A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals

Barry Mathieu, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 98–104.
https://doi.org/10.1115/1.2905512
Published Online: June 1, 1994
View Article titled, A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals
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Topics: Glass, Metals, Stress analysis (Engineering), Stress, Design, Experimental design, Fracture (Materials), Fracture (Process), Geometry, Simulation
Journal Articles

Solder Joint Reliability of Surface Mount Connectors

J. Lau, T. Marcotte, J. Severine, A. Lee, S. Erasmus, T. Baker, J. Moldaschel, M. Sporer, G. Burward-Hoy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1993, 115(2): 180–188.
https://doi.org/10.1115/1.2909315
Published Online: June 1, 1993
View Article titled, Solder Joint Reliability of Surface Mount Connectors
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Topics: Reliability, Solder joints, Surface mount packaging, Experimental methods