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Journal Articles

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Da Yu, Jae Kwak, Seungbae Park, Soonwan Chung, Ji-Young Yoon

Publisher: ASME

J. Electron. Packag. September 2012, 134(3): 031010.

https://doi.org/10.1115/1.4007118

Published Online: July 23, 2012

View Article titled, Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Topics: Deformation, Dynamic response, Failure, Finite element model, Shapes, Solder joints, Stress, Displacement, Stress analysis (Engineering), Manufacturing

Journal Articles

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

S. B. Park, Chirag Shah, Jae B. Kwak, Changsoo Jang, Soonwan Chung, James M. Pitarresi

Publisher: ASME

J. Electron. Packag. December 2008, 130(4): 044502.

https://doi.org/10.1115/1.3000097

Published Online: November 17, 2008

View Article titled, Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

Topics: Accelerometers, Deformation, Dynamic response, Printed circuit boards, Strain gages, Transients (Dynamics), Lumber, Displacement

Journal Articles

Could Shock Tests Adequately Mimic Drop Test Conditions?

E. Suhir, ASME Fellow

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 170–177.

https://doi.org/10.1115/1.1487356

Published Online: July 26, 2002

View Article titled, Could Shock Tests Adequately Mimic Drop Test Conditions?

Topics: Dynamic response, Impulse (Physics), Shock (Mechanics), Vibration, Stress, Life testing, Deflection

Journal Articles

Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration

G. H. Lim, J. H. Ong, J. E. T. Penny

Publisher: ASME

J. Electron. Packag. June 1999, 121(2): 122–126.

https://doi.org/10.1115/1.2792666

Published Online: June 1, 1999

View Article titled, Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration

Topics: Printed circuit boards, Vibration, Wedges, Boundary-value problems, Dynamic response, Springs, Vibration tests

Journal Articles

A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations

H. A. Jensen, A. O. Cifuentes

Publisher: ASME

J. Electron. Packag. December 1998, 120(4): 391–394.

https://doi.org/10.1115/1.2792652

Published Online: December 1, 1998

View Article titled, A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations

Topics: Electronic systems, Excitation, Sensitivity analysis, Design, Dynamic response, Electronic components, Uncertainty

Journal Articles

A Global Sensitivity Approach for the Dynamic Response of Printed Wiring Boards

H. Jensen, A. O. Cifuentes

Publisher: ASME

J. Electron. Packag. March 1995, 117(1): 7–13.

https://doi.org/10.1115/1.2792071

Published Online: March 1, 1995

View Article titled, A Global Sensitivity Approach for the Dynamic Response of Printed Wiring Boards

Topics: Dynamic response, Printed circuit boards, Design

Journal Articles

Nonlinear Dynamic Response of a Printed Circuit Board to Shock Loads Applied to Its Support Contour

E. Suhir

Publisher: ASME

J. Electron. Packag. December 1992, 114(4): 368–377.

https://doi.org/10.1115/1.2905467

Published Online: December 1, 1992

View Article titled, Nonlinear Dynamic Response of a Printed Circuit Board to Shock Loads Applied to Its Support Contour

Topics: Dynamic response, Printed circuit boards, Shock (Mechanics), Stress, Deflection, Dimensions, Electronic components, Membranes

Journal Articles

Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards

J. M. Pitarresi, A. A. Primavera

Publisher: ASME

J. Electron. Packag. December 1992, 114(4): 378–383.

https://doi.org/10.1115/1.2905468

Published Online: December 1, 1992

View Article titled, Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards

Topics: Circuits, Modeling, Vibration analysis, Reliability, Mode shapes, Copper, Dynamic response, Electronic packages, Electronics, Epoxy adhesives

Journal Articles

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

Tin-Lup Wong, Karl K. Stevens, Gang Wang

Publisher: ASME

J. Electron. Packag. September 1991, 113(3): 244–249.

https://doi.org/10.1115/1.2905402

Published Online: September 1, 1991

View Article titled, Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

Topics: Dynamic models, Dynamic response, Electronic components, Lumber, Modal analysis, Mode shapes, Structural dynamics, Surface mount components, Surface mount packaging, Testing

Journal citation

NARROW

Effect of Shield-Can on Dynamic Response of Board-Level Assembly

Measurement of Transient Dynamic Response of Circuit Boards of a Handheld Device During Drop Using 3D Digital Image Correlation

Could Shock Tests Adequately Mimic Drop Test Conditions?

Effect of Edge and Internal Point Support of a Printed Circuit Board Under Vibration

A Global Multidimensional Sensitivity Analysis of Electronic Systems Subjected to Time-Dependent Excitations

A Global Sensitivity Approach for the Dynamic Response of Printed Wiring Boards

Nonlinear Dynamic Response of a Printed Circuit Board to Shock Loads Applied to Its Support Contour

Comparison of Modeling Techniques for the Vibration Analysis of Printed Circuit Cards

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

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