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Journal Articles

Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging

Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020804.
Paper No: EP-20-1070
https://doi.org/10.1115/1.4049293
Published Online: February 22, 2021
View Article titled, Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
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Topics: Electronics, Gallium nitride, Heat, Nanoscale phenomena, Phonons, Temperature, Thermal conductivity, Electromagnetic scattering, Energy gap, Diamonds
Journal Articles

Embedded Cooling for Wide Bandgap Power Amplifiers: A Review

A. Bar-Cohen, J. J. Maurer, D. H. Altman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. December 2019, 141(4): 040803.
Paper No: EP-18-1067
https://doi.org/10.1115/1.4043404
Published Online: July 30, 2019
View Article titled, Embedded Cooling for Wide Bandgap Power Amplifiers: A Review
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Topics: Cooling, Diamonds, Gallium nitride, Microfluidics, Transistors, Thermal conductivity, Temperature, Junctions, Heat, Thermal management
Journal Articles

Thermal Conductivity of Diamond-Containing Grease

Hung-En Chou, Shang-Ray Yang, Sea-Fue Wang, James C. Sung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041015.
https://doi.org/10.1115/1.4003002
Published Online: December 9, 2010
View Article titled, Thermal Conductivity of Diamond-Containing Grease
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Topics: Diamonds, Fillers (Materials), Plasma desorption mass spectrometry, Thermal conductivity, Viscosity
Journal Articles

An Investigation of Flat-Plate Oscillating Heat Pipes

Peng Cheng, Scott Thompson, Joe Boswell, H. B. Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
https://doi.org/10.1115/1.4002726
Published Online: November 24, 2010
View Article titled, An Investigation of Flat-Plate Oscillating Heat Pipes
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Topics: Diamonds, Flat plates, Fluids, Heat pipes, Heat transfer, Nanofluids, Temperature, Thermal resistance, Water, Operating temperature
Journal Articles

Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment

Pablo D. Quinones, Lawrence S. Mok
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
https://doi.org/10.1115/1.3153407
Published Online: July 14, 2009
View Article titled, Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment
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Topics: Copper, Heat, Heat pipes, Heat sinks, Thermal conductivity, Thermal resistance, Cooling, Modeling, Flow (Dynamics), Finite element analysis
Journal Articles

In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates

Jun Xu, Richard A. Wirtz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 353–356.
https://doi.org/10.1115/1.1997162
Published Online: October 31, 2004
View Article titled, In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates
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Topics: Diamonds, Laminates, Thermal conductivity, Porosity
Journal Articles

Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor

Shiva P. Gadag, Susan K. Patra, Volkan Ozguz, Phillipe Marchand, Sadik Esener
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2002, 124(3): 198–204.
https://doi.org/10.1115/1.1481894
Published Online: July 26, 2002
View Article titled, Design and Analysis: Thermal Emulator Cubes for Opto-Electronic Stacked Processor
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Topics: Cables, Ceramics, Composite materials, Convection, Cooling, Design, Finite element analysis, Finite element model, Heat, Heat sinks
Journal Articles

Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 271–276.
https://doi.org/10.1115/1.1481374
Published Online: July 26, 2002
View Article titled, Evaluation and Improvement of the Adhesive Fracture Toughness of CVD Diamond on Silicon Substrate
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Topics: Adhesives, Diamonds, Fracture toughness, Methane, Particulate matter, Silicon, Synthetic diamonds, Fracture (Materials), Graphite
Journal Articles

The Effects of Material Properties on Heat Dissipation in High Power Electronics

T. J. Lu, A. G. Evans, J. W. Hutchinson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 280–289.
https://doi.org/10.1115/1.2792634
Published Online: September 1, 1998
View Article titled, The Effects of Material Properties on Heat Dissipation in High Power Electronics
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Topics: Electronics, Energy dissipation, Heat, Materials properties, Thermal conductivity, Cooling, Approximation, Diamonds, Dimensions, Insulation
Journal Articles

Thermal Performance of Pin-Fin Fan-Sink Assemblies

R. A. Wirtz, R. Sohal, H. Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 26–31.
https://doi.org/10.1115/1.2792197
Published Online: March 1, 1997
View Article titled, Thermal Performance of Pin-Fin Fan-Sink Assemblies
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Topics: Axial flow, Blades, Corners (Structural elements), Diamonds, Fins, Heat sinks, Heat transfer coefficients, Pressure, Shapes, Thermal resistance
Journal Articles

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

D. A. Bittle, J. C. Suhling, R. E. Beaty, R. C. Jaeger, R. W. Johnson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 203–215.
https://doi.org/10.1115/1.2905397
Published Online: September 1, 1991
View Article titled, Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages
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Topics: Electronic packages, Sensors, Stress, Structural analysis, Semiconductor wafers, Crystals, Design, Diamonds, Heat conduction, Integrated circuits