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Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

M. Y. Tsai, T. C. Kuo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034502.
Paper No: EP-22-1060
https://doi.org/10.1115/1.4056717
Published Online: February 8, 2023
View Article titled, A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests
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Topics: Bending strength, Silicon, Stress, Displacement, Failure mechanisms
Journal Articles

Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test

M. Y. Tsai, H. Y. Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031002.
Paper No: EP-20-1125
https://doi.org/10.1115/1.4051256
Published Online: September 15, 2021
View Article titled, Geometric Nonlinear Effect on Biaxial Bending Strength of Thin Silicon Die in the Ball-on-Ring Test
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Topics: Bending strength, Silicon, Stress, Fittings, Deflection
Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041007.
Paper No: EP-19-1034
https://doi.org/10.1115/1.4044961
Published Online: October 18, 2019
View Article titled, Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses
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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness
Journal Articles

The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds

Yowching Liaw, Jung-Hua Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031007.
Paper No: EP-16-1120
https://doi.org/10.1115/1.4037145
Published Online: July 10, 2017
View Article titled, The Effects of Silica Fillers on the Properties of Encapsulation Molding Compounds
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Topics: Fillers (Materials), Molding, Flow (Dynamics), Thermal conductivity, Water absorption, Bending strength
Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
https://doi.org/10.1115/1.1534842
Published Online: March 14, 2003
View Article titled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Shear (Mechanics), Shear strength, Solders, Silver, Resistors, Alloys
Journal Articles

Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin

Noriyasu Kawamura, Takashi Kawakami, Kikuo Kishimoto, Masaki Omiya, Toshikazu Shibuya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 323–327.
https://doi.org/10.1115/1.1501304
Published Online: December 12, 2002
View Article titled, Strength Evaluation of Notch Structure for Semiconductor Encapsulant Resin
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Topics: Fracture (Materials), Fracture (Process), Fracture toughness, Resins, Semiconductors (Materials), Stress, Temperature, Stress concentration, Finite element analysis, Delamination
Journal Articles

Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic

J. M. Hu, D. Barker, R. Ghoshtagore, M. Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 148–153.
https://doi.org/10.1115/1.2905503
Published Online: June 1, 1994
View Article titled, Investigation of Thermomechanical Properties of Low Temperature Cofired Ceramic
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Topics: Ceramics, Low temperature, Thermomechanics, Temperature, Bending strength, Design, Elastic moduli, Electronic packages, Fracture toughness, Materials properties
Journal Articles

Temperature Dependence of the Mechanical Properties of GaAs Wafers

Jun Ming Hu, Michael Pecht
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 331–336.
https://doi.org/10.1115/1.2905416
Published Online: December 1, 1991
View Article titled, Temperature Dependence of the Mechanical Properties of GaAs Wafers
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Topics: Gallium arsenide, Mechanical properties, Semiconductor wafers, Temperature effects, Materials properties, Temperature, Bending strength, Design, Elastic moduli, Elemental semiconductors