1-20 of 93
Alloys
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling

Rilwan Kayode Apalowo, Mohamad Aizat Abas, Muhamed Abdul Fatah Muhamed Mukhtar, Mohamad Riduwan Ramli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011005.
Paper No: EP-24-1049
https://doi.org/10.1115/1.4065805
Published Online: July 16, 2024
View Article titled, Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling
Open the PDF for Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling in another window
Topics: Alloys, Fatigue life, Solder joints, Solders, Temperature profiles, Ball-Grid-Array packaging, Stress, Temperature, Cycles, Fatigue
Journal Articles

Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials

E. Stang, C. Lesko, D. Young
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031008.
Paper No: EP-23-1044
https://doi.org/10.1115/1.4064751
Published Online: March 13, 2024
View Article titled, Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials
Open the PDF for Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials in another window
Topics: Creep, Solders, Stress, Temperature, Testing, Alloys
Journal Articles

Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021004.
Paper No: EP-22-1026
https://doi.org/10.1115/1.4062868
Published Online: November 10, 2023
View Article titled, Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
Open the PDF for Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method in another window
Topics: Solders, Temperature, Shock (Mechanics), Alloys
Journal Articles

Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging

Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Xin Wei, Abdallah Alakayleh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011008.
Paper No: EP-23-1011
https://doi.org/10.1115/1.4062894
Published Online: July 21, 2023
View Article titled, Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging
Open the PDF for Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging in another window
Topics: Alloys, Creep, Stress, Solder joints, Solders
Journal Articles

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Xin Wei, Sa'd Hamasha, Ali Alahmer, Mohamed El Amine Belhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031005.
Paper No: EP-22-1066
https://doi.org/10.1115/1.4056559
Published Online: January 27, 2023
View Article titled, Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
Open the PDF for Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches in another window
Topics: Ball-Grid-Array packaging, Cycles, Fatigue, Finishes, Solder joints, Stress, Fatigue life, Solders, Alloys
Journal Articles

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021007.
Paper No: EP-22-1044
https://doi.org/10.1115/1.4055318
Published Online: September 28, 2022
View Article titled, Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
Open the PDF for Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis in another window
Topics: Alloys, Fatigue, Shear (Mechanics), Shear strength, Solders, Tin, Stress, Solder joints, Fatigue testing, Fatigue life
Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
https://doi.org/10.1115/1.4054096
Published Online: March 31, 2022
View Article titled, Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
Open the PDF for Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints in another window
Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure
Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021116.
Paper No: EP-21-1062
https://doi.org/10.1115/1.4053764
Published Online: March 11, 2022
View Article titled, Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
Open the PDF for Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature in another window
Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties
Journal Articles

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Alexis Krone, Josh Kasitz, David Huitink, Hannah Alpert, Debbie G. Senesky, Satish Shetty, Gregory Salamo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021115.
Paper No: EP-21-1064
https://doi.org/10.1115/1.4053765
Published Online: March 7, 2022
View Article titled, High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors
Open the PDF for High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors in another window
Topics: Gallium, Gallium nitride, Hall effect, High temperature, Sensors, Temperature, Alloys, Reliability
Journal Articles

Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy

Zheng Liu, Li Yang, Yifeng Xiong, Huiming Gao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011002.
Paper No: EP-20-1077
https://doi.org/10.1115/1.4051025
Published Online: August 6, 2021
View Article titled, Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy
Open the PDF for Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy in another window
Topics: Alloys, Composite materials, Nanoparticles, Solders, Tin, Tensile strength
Journal Articles

Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 021005.
Paper No: EP-20-1080
https://doi.org/10.1115/1.4048181
Published Online: October 8, 2020
View Article titled, Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys
Open the PDF for Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys in another window
Topics: Alloys, Solders, Temperature, Stress, Solder joints, Operating temperature
Journal Articles

State of the Art of Lead-Free Solder Joint Reliability

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2021, 143(2): 020803.
Paper No: EP-20-1059
https://doi.org/10.1115/1.4048037
Published Online: September 3, 2020
View Article titled, State of the Art of Lead-Free Solder Joint Reliability
Open the PDF for State of the Art of Lead-Free Solder Joint Reliability in another window
Topics: Alloys, Creep, Failure, Reliability, Solder joints, Solders, Temperature, Viscoplasticity, Lead-free solders, Stress
Journal Articles

Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint

Minghong Jian, Sinan Su, Sa'd Hamasha, Mohammad M. Hamasha, Atif Alkhazali
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011008.
Paper No: EP-19-1117
https://doi.org/10.1115/1.4047341
Published Online: June 23, 2020
View Article titled, Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint
Open the PDF for Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint in another window
Topics: Alloys, Fatigue, Fatigue life, Solder joints, Solders, Stress, Cycles, Energy dissipation, Fatigue properties, Reliability
Journal Articles

Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Manny X. de Jesús-López, Pedro O. Quintero, Lauren M. Boteler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031110.
Paper No: EP-20-1013
https://doi.org/10.1115/1.4047063
Published Online: May 13, 2020
View Article titled, Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles
Open the PDF for Metallic Phase Change Material's Microstructural Stability Under Repetitive Melting/Solidification Cycles in another window
Topics: Cycles, Melting, Metals, Solidification, Temperature, Alloys, Stability
Journal Articles

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2020, 142(1): 014502.
Paper No: EP-19-1039
https://doi.org/10.1115/1.4044774
Published Online: September 24, 2019
View Article titled, Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy
Open the PDF for Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy in another window
Topics: Contact resistance, Melting, Optical fiber, Temperature, Pressure, Alloys, Stress, Heating, Surface roughness, Heat sinks
Journal Articles

Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking

Quang T. Su, Mohammad A. Gharaibeh, Aaron J. Stewart, James M. Pitarresi, Martin K. Anselm
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041004.
Paper No: EP-17-1062
https://doi.org/10.1115/1.4040923
Published Online: August 20, 2018
View Article titled, Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking
Open the PDF for Accelerated Vibration Reliability Testing of Electronic Assemblies Using Sine Dwell With Resonance Tracking in another window
Topics: Deflection, Failure, Failure analysis, Finite element analysis, Finite element model, Manufacturing, Reliability, Resonance, Solder joints, Solders
Journal Articles

Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint

Sinan Su, Nianjun Fu, Francy John Akkara, Sa'd Hamasha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031005.
Paper No: EP-17-1107
https://doi.org/10.1115/1.4040105
Published Online: May 21, 2018
View Article titled, Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint
Open the PDF for Effect of Long-Term Room Temperature Aging on the Fatigue Properties of SnAgCu Solder Joint in another window
Topics: Alloys, Fatigue life, Solder joints, Solders, Stress, Temperature, Cycles, Fatigue
Journal Articles

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010906.
Paper No: EP-17-1101
https://doi.org/10.1115/1.4039027
Published Online: March 2, 2018
View Article titled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics
Open the PDF for Lead-Free Alternatives for Interconnects in High-Temperature Electronics in another window
Topics: Alloys, Electronics, High temperature, Solders, Temperature, Testing, Thermal conductivity, Failure, Melting, Tensile testing
Journal Articles

Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys

Joel Thambi, Andreas Schiessl, Manuela Waltz, Klaus-Dieter Lang, Ulrich Tetzlaff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031002.
Paper No: EP-16-1064
https://doi.org/10.1115/1.4035850
Published Online: June 14, 2017
View Article titled, Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys
Open the PDF for Modified Constitutive Creep Laws With Micromechanical Modeling of Pb-Free Solder Alloys in another window
Topics: Alloys, Creep, Stress, Temperature, Tin, Modeling
Journal Articles

Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials

Yunxia Gao, Xianping Wang, Jing Liu, Qianfeng Fang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011002.
Paper No: EP-16-1099
https://doi.org/10.1115/1.4035025
Published Online: November 23, 2016
View Article titled, Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials
Open the PDF for Investigation on the Optimized Binary and Ternary Gallium Alloy as Thermal Interface Materials in another window
Topics: Alloys, Copper, Gallium, Gallium alloys, Temperature, Thermal conductivity, Oxidation, Thermal resistance, Aluminum alloys, Metals