Volume 146 Issue 4 | J. Electron. Packag.

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Volume 146, Issue 4

December 2024

ISSN 1043-7398

EISSN 1528-9044

Review Articles

Multiphysics Coupling in IGBT Modules: A Review

Weiqiang Tian, Naichao Chen

J. Electron. Packag. December 2024, 146(4): 040801. doi: https://doi.org/10.1115/1.4065941

Abstracts

View articletitled, Multiphysics Coupling in IGBT Modules: A Review

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Topics: Insulated-gate bipolar transistors , Temperature

Special Papers

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia

J. Electron. Packag. December 2024, 146(4): 041101. doi: https://doi.org/10.1115/1.4065446

Abstracts

View articletitled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

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Topics: Computer simulation , Cooling , Flow (Dynamics) , Heat , Heat sinks , Multi-chip modules , Pressure drop , Temperature , Fluids , Coolants

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia

J. Electron. Packag. December 2024, 146(4): 041102. doi: https://doi.org/10.1115/1.4065537

Abstracts

View articletitled, Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

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Topics: Coolants , Cooling , Data centers , Density , Heat , Heat exchangers , Temperature , Fluids , Stress , Cooling systems

Acoustic Characterization of Integrated Circuits During Operation

Josef Frankhouse, Changgen Li, Han Hu

J. Electron. Packag. December 2024, 146(4): 041103. doi: https://doi.org/10.1115/1.4065649

Abstracts

View articletitled, Acoustic Characterization of Integrated Circuits During Operation

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Topics: Acoustic emissions , Acoustics , Electronics , Integrated circuits , Signals , Stress , Waves , Sensors , Monitoring systems

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Reece Whitt, David Huitink

J. Electron. Packag. December 2024, 146(4): 041104. doi: https://doi.org/10.1115/1.4065944

Abstracts

View articletitled, Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

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Topics: Electronics , Flow (Dynamics) , Heat transfer , Junctions , Nozzles , Temperature , Temperature control , Testing , Transients (Dynamics) , Actuators

Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, Fred Buining

J. Electron. Packag. December 2024, 146(4): 041105. doi: https://doi.org/10.1115/1.4065863

Abstracts

View articletitled, Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

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Topics: Condensers (steam plant) , Cooling systems , Fluids , Heat , Secondary cells , Stress , Temperature , Thermal resistance , Pipeline risers , Risers (Casting)

Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad R. Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia

J. Electron. Packag. December 2024, 146(4): 041106. doi: https://doi.org/10.1115/1.4065942

Abstracts

View articletitled, Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

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Topics: Air conditioning , Coolants , Cooling , Temperature , Vehicles , Stress , Heat , HVAC equipment , Noise (Sound) , Flow (Dynamics)

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir

J. Electron. Packag. December 2024, 146(4): 041107. doi: https://doi.org/10.1115/1.4065943

Abstracts

View articletitled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

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Topics: Coating processes , Coatings , Copper , Plasma spraying , Spraying (Coating processes) , Sprays , Surface roughness , Ceramics , Electronics , Experimental design

Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors

Amir Abdolhosseinzadeh, Nazli Donmezer

J. Electron. Packag. December 2024, 146(4): 041108. doi: https://doi.org/10.1115/1.4065945

Abstracts

View articletitled, Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors

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Topics: Heat , Heating , Phonons , Temperature

Electrically Conductive Adhesives in Microelectronics Packaging

Mukund Ayalasomayajula, Mohit Ravi Khurana, Prince Shiva Chaudhary

J. Electron. Packag. December 2024, 146(4): 041109. doi: https://doi.org/10.1115/1.4065939

Abstracts

View articletitled, Electrically Conductive Adhesives in Microelectronics Packaging

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Topics: Adhesives , Fillers (Materials) , Anisotropy , Particulate matter

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Mostafa Olyaei, Sagar Singh, Kaiying Jiang, Yashraj Gurumukhi, Kenneth Goodson, Mehdi Asheghi, Nenad Miljkovic

J. Electron. Packag. December 2024, 146(4): 041110. doi: https://doi.org/10.1115/1.4065988

Abstracts

View articletitled, Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

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Topics: Batteries , Cycles , Temperature , Thermal management , Cooling

Convection Cooling of Power Electronics Operating in Deep-Space

Jessica Harsono, Joseph P. Kozak, Hala Tomey, William Yerkes, Jonathan Neville

J. Electron. Packag. December 2024, 146(4): 041111. doi: https://doi.org/10.1115/1.4065947

Abstracts

View articletitled, Convection Cooling of Power Electronics Operating in Deep-Space

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Topics: Design , Electronics , Fans , Forced convection , Heat , Simulation , Temperature , Thermal management , Packaging , Cooling

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer

J. Electron. Packag. December 2024, 146(4): 041112. doi: https://doi.org/10.1115/1.4066044

Abstracts

View articletitled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

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Topics: Cooling , Elastic moduli , Fluids , Temperature , Thermomechanics , Heat , Energy dissipation , Glass transition , Data centers , Reliability

Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Abhideep Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield

J. Electron. Packag. December 2024, 146(4): 041113. doi: https://doi.org/10.1115/1.4065987

Abstracts

View articletitled, Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

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Topics: Computational fluid dynamics , Cooling , Design , Heat sinks , Natural convection , Temperature , Triply periodic minimal surfaces , Manufacturing , Porosity

Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

Pradeep Lall, Hyesoo Jang, Curtis Hill

J. Electron. Packag. December 2024, 146(4): 041114. doi: https://doi.org/10.1115/1.4065940

Abstracts

View articletitled, Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

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Topics: Capacitance , Sensors , Temperature , Water , Simulation , Reliability , Printing

Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

Daiki Higuma, João Vitor Thomsen Silveira, Byunggi Kim, Masahiro Nomura, Kazuyoshi Fushinobu

J. Electron. Packag. December 2024, 146(4): 041115. doi: https://doi.org/10.1115/1.4066086

Abstracts

View articletitled, Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

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Topics: Algorithms , Lasers , Thermal conductivity , Thermal properties , Thermoreflectance , Temperature , Heat , Flow (Dynamics) , Thermal resistance , Interfacial thermal resistance

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Pradeep Lall, Sabina Bimali, Scott Miller

J. Electron. Packag. December 2024, 146(4): 041116. doi: https://doi.org/10.1115/1.4066041

Abstracts

View articletitled, Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

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Topics: Circuits , Design , Inks , Printing , Shear (Mechanics) , Silver , Sintering , Aerosols , Stress , Water

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez

J. Electron. Packag. December 2024, 146(4): 041117. doi: https://doi.org/10.1115/1.4065948

Abstracts

View articletitled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

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Topics: Cooling , Data centers , Flow (Dynamics) , Manifolds , Pressure , Pressure drop , Temperature , Modeling , Coolants , Calibration

Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

Victor A. Martinez, Carol Caceres, Alfonso Ortega

J. Electron. Packag. December 2024, 146(4): 041118. doi: https://doi.org/10.1115/1.4066101

Abstracts

View articletitled, Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

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Topics: Temperature , Thermal resistance , Thermocouples , Coolants , Errors , Flow (Dynamics) , Heat exchangers , Uncertainty

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

Joshua Kasitz, Muhammad Ghufran, David Huitink

J. Electron. Packag. December 2024, 146(4): 041120. doi: https://doi.org/10.1115/1.4066480

Abstract

View articletitled, Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

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Topics: Composite materials , Phase change materials , Silicones , Temperature , Particulate matter , Testing , Cooling , Insulation , Needles , Latent heat

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Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

Hisham Abusalma, Hayden Richards, Abhijit Dasgupta, Andres Bujanda, Harvey Tsang, Jian Yu

J. Electron. Packag. December 2024, 146(4): 041119. doi: https://doi.org/10.1115/1.4066320

Abstracts

View articletitled, Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

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Topics: Aerosols , Cantilevers , Durability , Extruding , Finite element analysis , Silver , Testing , Printing , Shock (Mechanics) , Strain gages

Review Articles

Multiphysics Coupling in IGBT Modules: A Review

Special Papers

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Acoustic Characterization of Integrated Circuits During Operation

Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics

Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors

Electrically Conductive Adhesives in Microelectronics Packaging

Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies

Convection Cooling of Power Electronics Operating in Deep-Space

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application

Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition

Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric

Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation

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Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes

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