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Issues
December 2021
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Guest Editorial
Special Issue Dedicated to Professor Avram Bar-Cohen
J. Electron. Packag. December 2021, 143(4): 040301.
doi: https://doi.org/10.1115/1.4052174
Topics:
Engineering teachers
Special Papers
Viability of Cryogenic Cooling to Reduce Processor Power Consumption
J. Electron. Packag. December 2021, 143(4): 041101.
doi: https://doi.org/10.1115/1.4051752
Topics:
Coolants
,
Cooling
,
Energy consumption
,
Flow (Dynamics)
,
Nitrogen
,
Temperature
,
Design
,
Leakage
,
Solenoids
,
Thermal stability
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control
J. Electron. Packag. December 2021, 143(4): 041102.
doi: https://doi.org/10.1115/1.4051942
Topics:
Compressors
,
Design
,
Flow (Dynamics)
,
Heat
,
Oscillations
,
Pressure drop
,
Secondary cells
,
Stability
,
Stress
,
Valves
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Omidreza Ghaffari, Wei Tong, Yaser Nabavi Larimi, Chady al Sayed, Alireza Ganjali, Jean-François Morissette, Francis Grenier, Simon Jasmin, Luc Fréchette, Julien Sylvestre
J. Electron. Packag. December 2021, 143(4): 041103.
doi: https://doi.org/10.1115/1.4051943
Topics:
Boiling
,
Cooling
,
Dielectric liquids
,
Heat
,
Temperature
,
Copper
,
Flat heat pipes
,
Pool boiling
,
Critical heat flux
,
Subcooling
Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads
J. Electron. Packag. December 2021, 143(4): 041104.
doi: https://doi.org/10.1115/1.4052360
Topics:
Boiling
,
Heat
,
Stress
,
Temperature
,
Transients (Dynamics)
,
Steady state
,
Heat flux
,
Vapors
Reduced Order Design Optimization of Liquid Cooled Heat Sinks
J. Electron. Packag. December 2021, 143(4): 041105.
doi: https://doi.org/10.1115/1.4052400
Topics:
Design
,
Flow (Dynamics)
,
Optimization
,
Pressure drop
,
Heat sinks
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
J. Electron. Packag. December 2021, 143(4): 041106.
doi: https://doi.org/10.1115/1.4052465
Topics:
Design
,
Drops
,
Evaporation
,
Heat conduction
,
Heat transfer
,
Heat transfer coefficients
,
Optimization
,
Particle swarm optimization
,
Shapes
,
Vapors
The Effect of Uneven Heating on the Flow Distribution Between Parallel Microchannels Undergoing Boiling
J. Electron. Packag. December 2021, 143(4): 041107.
doi: https://doi.org/10.1115/1.4052532
Topics:
Flow (Dynamics)
,
Heating
,
Microchannels
,
Boiling
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies
J. Electron. Packag. December 2021, 143(4): 041108.
doi: https://doi.org/10.1115/1.4052711
Topics:
Boiling
,
Cooling
,
Electronic packages
,
Injection molding
,
Metals
,
Printing
,
Additive manufacturing
,
Flat heat pipes
,
Manufacturing
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging
Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
J. Electron. Packag. December 2021, 143(4): 041109.
doi: https://doi.org/10.1115/1.4052814
Topics:
Algorithms
,
Artificial neural networks
,
Bridges (Structures)
,
Cooling
,
Heat sinks
,
Junctions
,
Machine learning
,
Machinery
,
Simulation
,
Steady state
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling
J. Electron. Packag. December 2021, 143(4): 041110.
doi: https://doi.org/10.1115/1.4052670
Topics:
Condensers (steam plant)
,
Heat
,
Stress
,
Flow (Dynamics)
,
Temperature
,
Fluids
,
Modeling
Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages
J. Electron. Packag. December 2021, 143(4): 041111.
doi: https://doi.org/10.1115/1.4052669
Topics:
Copper
,
Cycles
,
Junctions
,
Phase change materials
,
Temperature
,
Heat
,
Composite materials
,
Transients (Dynamics)
,
Thermal management
,
Cities
Microflow-Enhanced Bubble Dynamics Along With Gradient Porous Surfaces
J. Electron. Packag. December 2021, 143(4): 041112.
doi: https://doi.org/10.1115/1.4052790
Topics:
Boiling
,
Bubbles
,
Critical heat flux
,
Electrodeposition
,
Heat transfer
,
Copper
,
Dynamics (Mechanics)
,
Microscale devices
,
Fins
,
Flow (Dynamics)
Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces
J. Electron. Packag. December 2021, 143(4): 041113.
doi: https://doi.org/10.1115/1.4052716
Topics:
Critical heat flux
,
Disks
,
Vapors
,
Vessels
,
Boiling
,
Wavelength
,
Pool boiling
Announcement
Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal
J. Electron. Packag. December 2021, 143(4): 048001.
doi: https://doi.org/10.1115/1.4052403
Topics:
Electronics
,
Engineers
,
Leadership
,
Mentoring
,
Packaging
,
Photonics
Email alerts
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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
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Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
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