Topics: Annealing , Lead-free solders , Mechanical properties , Solder joints , Solders , Temperature gradient , Tin , Testing , Elastic moduli , Nanoindentation

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

M. A. Neidigk, Y.-L. Shen

J. Electron. Packag. March 2009, 131(1): 011003. doi: https://doi.org/10.1115/1.3068298

Abstract

View articletitled, Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

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Topics: Ceramics , Coating processes , Coatings , Computer simulation , Cooling , Epoxy resins , Failure , Ferrites (Magnetic materials) , Finite element analysis , Manufacturing

Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die

Abhijit Kaisare, Dereje Agonafer, A. Haji-Sheikh, Greg Chrysler, Ravi Mahajan

J. Electron. Packag. March 2009, 131(1): 011005. doi: https://doi.org/10.1115/1.3068303

Abstract

View articletitled, Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die

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Topics: Heat flux , Temperature , Temperature distribution , Computer simulation , Heat , Junctions , Heat sinks , Numerical analysis , Design , Optimization

Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate

Dapeng Zhu, Xiaoqin Lin, Le Luo

J. Electron. Packag. March 2009, 131(1): 011006. doi: https://doi.org/10.1115/1.3068305

Abstract

View articletitled, Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate

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Topics: Resistors , Thin films , Tantalum

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

J. J. M. Zaal, W. D. van Driel, F. J. H. G. Kessels, G. Q. Zhang

J. Electron. Packag. March 2009, 131(1): 011007. doi: https://doi.org/10.1115/1.3068311

Abstract

View articletitled, Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

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Topics: Impact testing , Reliability , Simulation , Solders , Testing , Deflection , Damping

A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects

David M. Pierce, Sheri D. Sheppard, Paul T. Vianco

J. Electron. Packag. March 2009, 131(1): 011008. doi: https://doi.org/10.1115/1.3068313

Abstract

View articletitled, A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects

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Topics: Alloys , Cycles , Dynamic light scattering , Fatigue , Fatigue life , Finite element analysis , Fracture (Materials) , Lead-free solders , Simulation , Solders

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink

J. Electron. Packag. March 2009, 131(1): 011009. doi: https://doi.org/10.1115/1.3068318

Abstract

View articletitled, Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

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Topics: Finite element analysis , Glass , Press fits , Shear stress , Stress , Thermal stresses , Welding , Wire , Bridges (Structures) , Laser welding

Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

Guojun Hu, Jing-En Luan, Spencer Chew

J. Electron. Packag. March 2009, 131(1): 011010. doi: https://doi.org/10.1115/1.3068321

Abstract

View articletitled, Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

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Topics: Epoxy resins , Finite element analysis , Molding , Shrinkage (Materials) , Warping , Thermal expansion , Temperature , Fillers (Materials)

Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity

Esam M. Alawadhi

J. Electron. Packag. March 2009, 131(1): 011011. doi: https://doi.org/10.1115/1.3068322

Abstract

View articletitled, Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity

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Topics: Flow (Dynamics) , Heat , Pressure drop , Reynolds number , Temperature , Thermal management , Transients (Dynamics) , Steady state , Cycles , Finite element methods

Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading

B. Wunderle, T. Braun, D. May, B. Michel, H. Reichl

J. Electron. Packag. March 2009, 131(1): 011012. doi: https://doi.org/10.1115/1.3078187

Abstract

View articletitled, Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading

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Topics: Capacitors , Ceramics , Fracture (Materials) , Capacitance , Simulation

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume

J. Electron. Packag. March 2009, 131(1): 011013. doi: https://doi.org/10.1115/1.3068301

Abstract

View articletitled, Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

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Topics: Electronic packages , Flip-chip devices , Lasers , Signals , Solders , Tin , Ultrasound , Vehicles , X-rays , Inspection

Sub- $100 μ m$ SnAg Solder Bumping Technology and the Bump Reliability

Xiaoqin Lin, Le Luo

J. Electron. Packag. March 2009, 131(1): 011014. doi: https://doi.org/10.1115/1.2957333

Abstract

View articletitled, Sub-<span class="inline-formula no-formula-id"><span class="mathFormula"></span><math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><mn>100</mn><mtext> </mtext><mi>μ</mi><mtext>m</mtext></mrow></math></span> SnAg Solder Bumping Technology and the Bump Reliability

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Topics: Solders , Shear strength , Reliability , Tin

Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages

M. Rayasam, S. Chaparala, D. Farnam, B. G. Sammakia, G. Subbarayan

J. Electron. Packag. March 2009, 131(1): 011015. doi: https://doi.org/10.1115/1.3077131

Abstract

View articletitled, Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages

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Topics: Design , Microchannels , Optimization , Heat

Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation

Y. Zhou, M. Al-Bassyiouni, A. Dasgupta

J. Electron. Packag. March 2009, 131(1): 011016. doi: https://doi.org/10.1115/1.3078195

Abstract

View articletitled, Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation

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Topics: Durability , Excitation , Fatigue , Printed circuit boards , Solders , Vibration , Finite element analysis , Failure

Research Papers

Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance

Yen-Shu Chen, Kuo-Hsiang Chien, Yung-Shin Tseng, Yea-Kuang Chan

J. Electron. Packag. March 2009, 131(1): 011004. doi: https://doi.org/10.1115/1.3068299

Abstract

View articletitled, Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance

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Topics: Approximation , Heat , Heat sinks , Plates (structures) , Thermal conductivity , Thermal resistance , Temperature distribution , Heat conduction , Design

Technical Briefs

Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin

G. De Mey, M. Wójcik, J. Pilarski, M. Lasota, J. Banaszczyk, B. Vermeersch, A. Napieralski, M. De Paepe

J. Electron. Packag. March 2009, 131(1): 014501. doi: https://doi.org/10.1115/1.3068307

Abstract

View articletitled, Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin

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Topics: Cooling , Natural convection , Thermal resistance , Transistors , Junctions

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Research Papers

Influence of Power Cycling Durations on Thermal and Fatigue Reliability Characteristics of Board-Level Chip-Scale Packages

Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties

Nonlinear Viscoelastic Finite Element Analysis of Physical Aging in an Encapsulated Transformer

Development of Analytical Model to a Temperature Distribution of a First Level Package With a Nonuniformly Powered Die

Integration of Ta–N Thin Film Resistors on Anodic Alumina MCM-D Substrate

Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Characterization of Chemical Cure Shrinkage of Epoxy Molding Compound With Application to Warpage Analysis

Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity

Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Sub- $100 μ m$ SnAg Solder Bumping Technology and the Bump Reliability

Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages

Vibration Durability Assessment of Sn3.0Ag0.5Cu and Sn37Pb Solders Under Harmonic Excitation

Research Papers

Determination of Optimized Rectangular Spreader Thickness for Lower Thermal Spreading Resistance

Technical Briefs

Chimney Effect on Natural Convection Cooling of a Transistor Mounted on a Cooling Fin

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