Topics: Deflection , Lamination , Plane strain , Printed circuit boards , Shear (Mechanics) , Shear deformation , Stress , Temperature , Warping , Laminates

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

R. Venkatraman, K. Ramakrishna, Mem. ASME, K. Knadle, W. T. Chen, Fellow ASME, G. C. Haddon

J. Electron. Packag. March 2001, 123(1): 6–15. doi: https://doi.org/10.1115/1.1326437

Abstract

View articletitled, Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

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Topics: Copper , Double refraction , Drilling , Drills (Tools) , Epoxy resins , Failure , Failure analysis , Finite element analysis , Fracture (Materials) , Glass

Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages

H. Fre´mont, J. Y. Dele´tage, A. Pintus, Y. Danto

J. Electron. Packag. March 2001, 123(1): 16–18. doi: https://doi.org/10.1115/1.1326436

Abstract

View articletitled, Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages

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Topics: Diffusion (Physics) , Molding , Resins , Water , Polymers , Diffusion processes , Weight (Mass) , Ceramics , Finite element analysis , Geometry

Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging

Chandra S. Desai, Mem. ASME, Russell Whitenack

J. Electron. Packag. March 2001, 123(1): 19–33. doi: https://doi.org/10.1115/1.1324675

Abstract

View articletitled, Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging

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Topics: Cycles , Damage , Failure , Finite element analysis , Fracture (Materials) , Fracture (Process) , Stress , Thermomechanics , Solders , Creep

Effect of Tool Wear on Force and Quality in Dam-Bar Cutting of Integrated Circuit Packages

C. F. Cheung, W. B. Lee, W. M. Chiu

J. Electron. Packag. March 2001, 123(1): 34–41. doi: https://doi.org/10.1115/1.1322564

Abstract

View articletitled, Effect of Tool Wear on Force and Quality in Dam-Bar Cutting of Integrated Circuit Packages

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Topics: Cutting , Dams , Wear

Microwave Imaging for the Integrity Assessment of IC Packages

Y. Ju, M. Saka, H. Abe´

J. Electron. Packag. March 2001, 123(1): 42–46. doi: https://doi.org/10.1115/1.1326440

Abstract

View articletitled, Microwave Imaging for the Integrity Assessment of IC Packages

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Topics: Delamination , Imaging , Microwaves , Sensors , Inspection , Reliability , Resolution (Optics) , Dimensions , Shapes

Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

M. Uschitsky, E. Suhir

J. Electron. Packag. March 2001, 123(1): 47–51. doi: https://doi.org/10.1115/1.1325009

Abstract

View articletitled, Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

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Topics: Diffusion (Physics) , Epoxy adhesives , Epoxy resins , Fillers (Materials) , Mechanical properties , Molding , Particulate matter , Sorption , Indium compounds , Stress

A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints

J. K. Chen, J. E. Beraun, D. Y. Tzou

J. Electron. Packag. March 2001, 123(1): 52–57. doi: https://doi.org/10.1115/1.1326438

Abstract

View articletitled, A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints

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Topics: Diffusion (Physics) , Intermetallic compounds , Solder joints , Chemical reactions

Flip-Chip BGA Design to Avert Die Cracking

J.-B. Han

J. Electron. Packag. March 2001, 123(1): 58–63. doi: https://doi.org/10.1115/1.1329130

Abstract

View articletitled, Flip-Chip BGA Design to Avert Die Cracking

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Topics: Ball-Grid-Array packaging , Design , Finite element analysis , Flip-chip , Fracture (Materials) , Fracture (Process) , Fracture mechanics , Cracking (Materials)

Development of Glass-Free Metal Electrically Conductive Thick Films

Zongrong Liu, D. D. L. Chung

J. Electron. Packag. March 2001, 123(1): 64–69. doi: https://doi.org/10.1115/1.1329131

Abstract

View articletitled, Development of Glass-Free Metal Electrically Conductive Thick Films

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Topics: Electrical resistivity , Glass , Metals , Thick films , Adhesion , Alloys

The Maximum Stress in Optical Glass Fibers Under Two-Point Bending

Mikio Muraoka

J. Electron. Packag. March 2001, 123(1): 70–73. doi: https://doi.org/10.1115/1.1324674

Abstract

View articletitled, The Maximum Stress in Optical Glass Fibers Under Two-Point Bending

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Topics: Bending (Stress) , Fibers , Optical glass , Stress , Stress-strain relations , Optical fiber

Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

Y.-L. Shen, W. Li, H. E. Fang

J. Electron. Packag. March 2001, 123(1): 74–78. doi: https://doi.org/10.1115/1.1324673

Abstract

View articletitled, Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

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Topics: Alloys , Deformation , Shear (Mechanics) , Stress , Fatigue , Tin , Damage , Eutectic alloys , Cycles , Modeling

Papers on Reliability

Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites

Amir Javidinejad, Shiv P. Joshi

J. Electron. Packag. March 2001, 123(1): 79–82. doi: https://doi.org/10.1115/1.1322563

Abstract

View articletitled, Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites

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Topics: Composite materials , Pressure , Pressure sensors , Sensors , Temperature sensors , Carbon fibers , Microelectromechanical systems , Reliability , Cycles

Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

Teck Joo Goh

J. Electron. Packag. March 2001, 123(1): 83–87. doi: https://doi.org/10.1115/1.1289999

Abstract

View articletitled, Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

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Topics: Design , Finite element analysis , Finite element model , Flip-chip , Flip-chip devices , Flip-chip packages , Heat sinks , Reliability , Stress , Silicon

Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

Takashi Aihara, Shingo Ito, Hideaki Sasajima, Ken Oota

J. Electron. Packag. March 2001, 123(1): 88–94. doi: https://doi.org/10.1115/1.1329129

Abstract

View articletitled, Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

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Topics: Ball-Grid-Array packaging , Fracture (Materials) , Molding , Solders , Warping , Insulation , Reliability , Fillers (Materials)

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Technical Papers

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

Evaluation of Smear and Its Effect on the Mechanical Integrity of Plated Through Hole-Inner Plane Interface in Thick Printed Wiring Boards

Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages

Review of Models and the Disturbed State Concept for Thermomechanical Analysis in Electronic Packaging

Effect of Tool Wear on Force and Quality in Dam-Bar Cutting of Integrated Circuit Packages

Microwave Imaging for the Integrity Assessment of IC Packages

Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints

Flip-Chip BGA Design to Avert Die Cracking

Development of Glass-Free Metal Electrically Conductive Thick Films

The Maximum Stress in Optical Glass Fibers Under Two-Point Bending

Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

Papers on Reliability

Autoclave Reliability of MEMS Pressure and Temperature Sensors Embedded in Carbon Fiber Composites

Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

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