An experimental study of forced convection in impinging flow, using fluorocarbon FX3250 and a simulated electronic chip, was performed. A test section consisting of a 35 mm long, 1 mm wide slot nozzle in a 2 mm thick plate offset 2 mm from the heat source was used. The simulated chip array consisted of five foil strip (4 mm wide) heaters, positioned with the center strip directly beneath the slot nozzle. The velocity of the coolant was varied from 0.53 to 5 m/s, and the subcooling in the range from 2 to 21 K. The experiments were conducted focusing on two cases. First, only the center strip was heated. Second, all the heaters were energized, and the strip-by-strip variations of heat transfer were measured. The critical heat flux (CHF) on the center strip, determined by sensing the onset of oscillations and subsequent rapid rise of foil temperatures, was found considerably lower than those predicted by the existing correlations. It is pointed out that the thermal mass of the test heater could be an important factor for the CHF. The heat transfer behavior of other strips showed channel-flow or jet-impingement mode depending on the strip location and the coolant flow rate. [S1043-7398(00)00202-4]

1.
Nakayama, W., 1997, “Liquid Cooling of Electronic Equipment: Where Does it Offer Variable Solutions?” Advances in Electronic Packaging, Vol. 2, E. Suhir, Y. C. Lee, M. Shiratori, and G. Subbarayan, eds., ASME, New York, pp. 2045–2052.
2.
Johns
,
M. E.
, and
Mudawar
,
I.
,
1996
, “
An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module
,”
ASME J. Electron. Packag.
,
118
, No.
4
, pp.
264
270
.
3.
Nakayama
,
W.
,
1990
, “
On the Accommodation of Coolant Flow Paths in High Density Packaging
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
CHMT-13
, No.
4
, pp.
1040
1049
.
4.
Heindel
,
T. J.
,
Ramadhyani
,
S.
, and
Incropera
,
F. P.
,
1992
, “
Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling
,”
ASME J. Electron. Packag.
,
114
, pp.
63
70
.
5.
Lin
,
Z. H.
,
Chou
,
Y. J.
, and
Hung
,
Y. H.
,
1997
, “
Heat Transfer Behaviors of a Confined Slot Jet Impingement
,”
Int. J. Heat Mass Transf.
,
40
, No.
5
, pp.
1095
1107
.
6.
Maddox, D. E., and Bar-Cohen, A., 1991, “Thermofluid Design of Submerged-Jet Impingement Cooling for Electronic Components,” Heat Transfer in Electronic Equipment, ASME HTD-171, pp. 71–80.
7.
Mudawar
,
I.
, and
Wadsworth
,
D. C.
,
1991
, “
Critical Heat Flux From a Simulated Chip to a Confined Rectangular Impinging Jet of Dielectric Liquid
,”
Int. J. Heat Mass Transf.
,
34
, No.
6
, pp.
1465
1479
.
8.
Nakayama
,
W.
,
Behnia
,
M.
,
Mishima
,
H.
, and
Sun
,
H.
,
1996
, “
Heat Transfer From an Array of Strips to Fluorinert Coolant in a Mixed Impinging-Jet/Channel-Flow Configuration
,”
ASME J. Electron. Packag.
,
118
, No.
1
, pp.
31
36
.
9.
Wadsworth
,
D. C.
, and
Mudawar
,
I.
,
1990
, “
Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid
,”
ASME J. Heat Transfer
,
112
, pp.
891
898
.
10.
Ma
,
C. F.
, and
Bergles
,
A. E.
,
1983
, “
Jet Impingement in Nucleate Boiling
,”
Int. J. Heat Mass Transf.
,
29
, No.
8
, pp.
1095
1101
.
11.
Sun
,
H.
,
Ma
,
C.-F.
, and
Nakayama
,
W.
,
1993
, “
Local Characteristics of Convective Heat Transfer from Simulated Microelectronic Chips to Impinging Submerged Round Water Jets
,”
ASME J. Electron. Packag.
,
115
, No.
1
, pp.
71
77
.
12.
Jaeger
,
R. C.
,
Goodling
,
J. S.
,
Baginski
,
M. E.
,
Ellis
,
C. D.
,
Williamson
,
N. V.
, and
O’Barr
,
R. M.
,
1989
, “
High Heat Flux Cooling for Silicon Hybrid Multichip Packaging
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
,
12
, No.
4
, pp.
772
779
.
13.
Schafer
,
D.
,
Incropera
,
F. P.
, and
Ramadhyani
,
S.
,
1991
, “
Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources
,”
ASME J. Electron. Packag.
,
113
, No.
4
, pp.
359
366
.
14.
Lee, T. Y., Simon, T. W., and Bar-Cohen, A., 1988, “An Investigation of Short-Heating Length Effects on Flow Boiling Critical Heat Flux in a Subcooled Turbulent Flow,” Cooling Technology for Electronic Equipment, W. Aung, ed., Hemisphere Publishing Corporation, pp. 435–450.
15.
Monde
,
M.
, and
Katto
,
Y.
,
1978
, “
Burnout in a High-Flux Boiling System With an Impinging Jet
,”
Int. J. Heat Mass Transf.
,
21
, pp.
295
305
.
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