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Keywords: RIE
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Proceedings Papers

Proc. ASME. IMECE2002, Microelectromechanical Systems, 189-194, November 17–22, 2002
Paper No: IMECE2002-39299
... properties. Here, the proposed modification method not only can apply to silicon without extra property requirements, but also has potential to modify other materials, such as oxide, nitride, and some metals. The process combined spin-on photoresist and reactive ion etching (RIE). The proposed low...