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Proceedings Papers

Microactuators Based on Electrothermal Expansion of Clamped-Clamped Beams

Mu Chiao, Liwei Lin

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 75-80, November 16–21, 1997

Paper No: IMECE1997-0942

DOI: https://doi.org/10.1115/IMECE1997-0942

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Topics: Microactuators, Microbeams, Computers, Displacement, Image processing, Micromachining, Polysilicon, Thermoelasticity

Proceedings Papers

A Lateral Repulsive-Force Drive Using Asymmetric Electrostatic Field

Ki Bang Lee, Young-Ho Cho

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 81-85, November 16–21, 1997

Paper No: IMECE1997-0943

DOI: https://doi.org/10.1115/IMECE1997-0943

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Topics: Atmospheric pressure, Displacement, Electric fields, Electrodes, Electromagnetic induction, Finite element analysis, Microactuators, Micromachining, Polysilicon, Resonance

Proceedings Papers

A Microstructure for the In Situ Determination of Residual Strain

Chi Shiang Pan, Wensyang Hsu

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 105-111, November 16–21, 1997

Paper No: IMECE1997-0947

DOI: https://doi.org/10.1115/IMECE1997-0947

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Topics: Annealing, Cantilever beams, Deflection, Displacement, Finite element analysis, Modeling, Polysilicon, Strain sensors, Young's modulus

Proceedings Papers

Design, Fabrication and Static Test of a Resonant Microaccelerometer

Si Young Kim, Jeung Sang Go, Young-Ho Cho

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 21-26, November 16–21, 1997

Paper No: IMECE1997-0933

DOI: https://doi.org/10.1115/IMECE1997-0933

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Topics: Design, Manufacturing, Resonance, Accelerometers, Micromachining, Polysilicon, Stress, Annealing, Deflection, Mechanical structures

Proceedings Papers

Advances in Tensile Testing of Polysilicon Thin Films

William N. Sharpe, Jr., Bin Yuan, Richard L. Edwards

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 113-116, November 16–21, 1997

Paper No: IMECE1997-1235

DOI: https://doi.org/10.1115/IMECE1997-1235

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Topics: Polysilicon, Tensile testing, Thin films, Testing, ASTM International, Mechanical properties, Displacement, Fracture (Materials), Fracture toughness, Mechanical testing

Proceedings Papers

A Micro Valve Made of PSPI

Xiaohao Wang, Zhaoying Zhou, Wendong Zhang

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 31-36, November 15–20, 1998

Paper No: IMECE1998-1220

DOI: https://doi.org/10.1115/IMECE1998-1220

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Topics: Valves, Pressure, Flow (Dynamics), Manufacturing, Design, Dimensions, Leakage, Micropumps, Polysilicon, Silicon

Proceedings Papers

Electrothermal and Fabrication Modeling of Polysilicon Thermal Actuators

Jeffrey T. Butler, Victor M. Bright

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 571-576, November 15–20, 1998

Paper No: IMECE1998-1302

DOI: https://doi.org/10.1115/IMECE1998-1302

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Topics: Actuators, Manufacturing, Modeling, Polysilicon, Microelectromechanical systems, Circuits, Electrical resistivity, Pistons

Proceedings Papers

Electrostatic Mechanical Testing of Polysilicon

William N. Sharpe, Jr., Kevin Turner, Richard L. Edwards

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 385-388, November 15–20, 1998

Paper No: IMECE1998-1273

DOI: https://doi.org/10.1115/IMECE1998-1273

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Topics: Mechanical testing, Polysilicon, Brittleness, Cross section (Physics), Displacement, Interferometry, Lasers, Microelectromechanical systems, Tensile strength, Testing

Proceedings Papers

Blister-Like Local Buckling of Polysilicon Microbeams During Wet-Release

Xin Zhang, Yitshak Zohar, Tong-Yi Zhang

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 379-384, November 15–20, 1998

Paper No: IMECE1998-1272

DOI: https://doi.org/10.1115/IMECE1998-1272

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Topics: Buckling, Microbeams, Polysilicon, Drying, Manufacturing, Stress

Proceedings Papers

A Constrained Thermal Expansion Micro-Actuator

Rebecca Cragun, Larry L. Howell

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 365-371, November 15–20, 1998

Paper No: IMECE1998-1270

DOI: https://doi.org/10.1115/IMECE1998-1270

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Topics: Microactuators, Thermal expansion, Actuators, Compliant mechanisms, Cycles, Deflection, Finite element analysis, Polysilicon, Visualization

Proceedings Papers

Crack Growth in Polysilicon MEMS

William W. Van Arsdell, Stuart B. Brown

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 267-272, November 15–20, 1998

Paper No: IMECE1998-1253

DOI: https://doi.org/10.1115/IMECE1998-1253

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Topics: Fracture (Materials), Microelectromechanical systems, Polysilicon, Stress, Stress corrosion cracking, Dynamics (Mechanics), Frequency response, Nonlinear dynamics, Nonlinear systems, Water

Proceedings Papers

Tribology on the Macro- to Nanoscales of MEMS Materials: A Review

Bharat Bhushan

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 265-266, November 15–20, 1998

Paper No: IMECE1998-1252

DOI: https://doi.org/10.1115/IMECE1998-1252

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Topics: Microelectromechanical systems, Tribology, Friction, Silicon, Polysilicon, Microscale devices, Crystals, Wear, Boundary lubrication, Nanoindentation

Proceedings Papers

Size Effects on Mechanical Properties of Polysilicon

William N. Sharpe, Jr.

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 153-155, November 15–20, 1998

Paper No: IMECE1998-1153

DOI: https://doi.org/10.1115/IMECE1998-1153

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Topics: Mechanical properties, Polysilicon, Microelectromechanical systems, Vapors, Young's modulus

Proceedings Papers

Adhesion, Adhesion Hysteresis and Friction in MEMS Under Controlled Humidity Ambients

M. P. de Boer, J. A. Knapp, J. M. Redmond, T. A. Michalske, R. Maboudian

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 127-129, November 15–20, 1998

Paper No: IMECE1998-1145

DOI: https://doi.org/10.1115/IMECE1998-1145

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Topics: Adhesion, Friction, Microelectromechanical systems, Coatings, Polysilicon, Condensation, Micromachining, Reliability, Surface properties

Proceedings Papers

Structure and Behavior of Materials for Micromechanical Devices

Peter Krulevitch, Kirk P. Seward, Harold D. Ackler, George C. Johnson, Roger T. Howe

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 131-133, November 15–20, 1998

Paper No: IMECE1998-1146

DOI: https://doi.org/10.1115/IMECE1998-1146

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Topics: Buckling, Crystallization, Electron microscopy, Etching, Fatigue, Film thickness, Fracture (Materials), Fracture (Process), Mechanical behavior, Microactuators

Proceedings Papers

Fatigue and Fracture Testing of Microelectromechanical Systems

Roberto Ballarini, Robert L. Mullen, Harold Kahn, Arthur H. Heuer

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 151-152, November 15–20, 1998

Paper No: IMECE1998-1152

DOI: https://doi.org/10.1115/IMECE1998-1152

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Topics: Fatigue, Fracture (Materials), Fracture (Process), Microelectromechanical systems, Testing, Bending strength, Crack propagation, Design, Dimensions, Electrostatic actuators

Proceedings Papers

Technology and System Challenges for 300 mm Metal and Polysilicon Plasma Etch

James Papanu, Peter Loewenhardt, Dale Olson, Arnold Kholodenko

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 839-843, November 15–20, 1998

Paper No: IMECE1998-1099

DOI: https://doi.org/10.1115/IMECE1998-1099

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Topics: Etching, Metals, Plasmas (Ionized gases), Polysilicon, Design, Semiconductor wafers, Fluid dynamics, Hardware, Simulation

Proceedings Papers

Nanosecond Laser Experiments of Microstructure Adhesion Reduction

James W. Rogers, Leslie M. Phinney

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 25-30, November 14–19, 1999

Paper No: IMECE1999-1059

DOI: https://doi.org/10.1115/IMECE1999-1059

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Topics: Adhesion, Lasers, Microcantilevers, Stiction, Cantilevers, Fluence (Radiation measurement), Nd-YAG lasers, Polysilicon

Proceedings Papers

Nonlinear Deformation of Multilayer MEMS Structures

Martin L. Dunn, Yanhang Zhang, Jeffrey M. Roy, Paul E. W. Labossiere, Victor M. Bright

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 75-79, November 14–19, 1999

Paper No: IMECE1999-0248

DOI: https://doi.org/10.1115/IMECE1999-0248

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Topics: Deformation, Microelectromechanical systems, Plates (structures), Polysilicon, Shapes, Bifurcation, Microscopes, Temperature

Proceedings Papers

Localized Deposition of Polysilicon for MEMS Post-Fabrication Processing

Daphne Joachim, Liwei Lin

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 37-42, November 14–19, 1999

Paper No: IMECE1999-0243

DOI: https://doi.org/10.1115/IMECE1999-0243

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Topics: Manufacturing, Microelectromechanical systems, Polysilicon, Microbeams, Finite element analysis, Sealing (Process), Silicon, Temperature

2 3 4 5

NARROW

Microactuators Based on Electrothermal Expansion of Clamped-Clamped Beams

A Lateral Repulsive-Force Drive Using Asymmetric Electrostatic Field

A Microstructure for the In Situ Determination of Residual Strain

Design, Fabrication and Static Test of a Resonant Microaccelerometer

Advances in Tensile Testing of Polysilicon Thin Films

A Micro Valve Made of PSPI

Electrothermal and Fabrication Modeling of Polysilicon Thermal Actuators

Electrostatic Mechanical Testing of Polysilicon

Blister-Like Local Buckling of Polysilicon Microbeams During Wet-Release

A Constrained Thermal Expansion Micro-Actuator

Crack Growth in Polysilicon MEMS

Tribology on the Macro- to Nanoscales of MEMS Materials: A Review

Size Effects on Mechanical Properties of Polysilicon

Adhesion, Adhesion Hysteresis and Friction in MEMS Under Controlled Humidity Ambients

Structure and Behavior of Materials for Micromechanical Devices

Fatigue and Fracture Testing of Microelectromechanical Systems

Technology and System Challenges for 300 mm Metal and Polysilicon Plasma Etch

Nanosecond Laser Experiments of Microstructure Adhesion Reduction

Nonlinear Deformation of Multilayer MEMS Structures

Localized Deposition of Polysilicon for MEMS Post-Fabrication Processing

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