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Proceedings Papers

Overview of the Base Model for the Parametric Sensitivity Studies Specific to Performance Assessments of U-Mo Fuel Plates

Hakan Ozaltun, Hee Seok Roh, Walid Mohamed

Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A046, October 30–November 3, 2022

Paper No: IMECE2022-93718

DOI: https://doi.org/10.1115/IMECE2022-93718

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Topics: Fuels, Plates (structures), Geometry, Irradiation (Radiation exposure), Aluminum, Constitutive equations, Creep, Density, Design, Diffusion (Physics)

Proceedings Papers

Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature

Shogo Tezuka, Ken Suzuki

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A036, October 30–November 3, 2022

Paper No: IMECE2022-94286

DOI: https://doi.org/10.1115/IMECE2022-94286

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Topics: Alloys, Creep, Diffusion (Physics), Fatigue, Grain boundaries, Heat, Molecular dynamics, Stress, Temperature

Proceedings Papers

Acceleration of Intergranular Cracking in Ni-Base Alloy GH4169 (IN718) Due to the Growth of δ-Phase Around Grain Boundaries Under Creep Loading at Elevated Temperatures

Ayumi Nakayama, Runzi Wang, Hideo Miura

Paper No: IMECE2022-94701

DOI: https://doi.org/10.1115/IMECE2022-94701

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Topics: Alloys, Cracking (Materials), Creep, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Temperature

Proceedings Papers

Effect of Strain Rate on the Creep-Fatigue Damage of Polycrystalline Ni-Base Superalloy at Elevated Temperature

Koki Nakayama, Hideo Miura

Paper No: IMECE2022-94282

DOI: https://doi.org/10.1115/IMECE2022-94282

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Topics: Alloys, Creep, Damage, Electron backscatter diffraction, Fatigue, Fracture (Process), Superalloys, Temperature

Proceedings Papers

Numerical Simulation of Aged Reinforced Concrete Column Nonlinear Creep due to High Sustained Load

Wenchen Ma

Paper No: IMECE2022-94840

DOI: https://doi.org/10.1115/IMECE2022-94840

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Topics: Computer simulation, Creep, Reinforced concrete, Stress

Proceedings Papers

Prediction of the Generation of Intergranular Cracking in Stainless Steels Under Creep Loading at Elevated Temperatures

Ken Suzuki, Koki Nakayama, Ayumi Nakayama, Shogo Tezuka, Hideo Miura

Paper No: IMECE2022-94891

DOI: https://doi.org/10.1115/IMECE2022-94891

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Topics: Cracking (Materials), Creep, Electron backscatter diffraction, Fracture (Process), Grain boundaries, Stainless steel, Stress, Temperature, Damage, Dislocations

Proceedings Papers

Unified Constitutive Modeling of Haynes 230 for Thermomechanical Fatigue-Creep and Creep Behavior

Wenyu Cao, Hualiang Zhang

Paper No: IMECE2022-94802

DOI: https://doi.org/10.1115/IMECE2022-94802

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Topics: Creep, Fatigue, Modeling, Thermomechanics

Proceedings Papers

Creep-Fatigue Reliability Analysis Integrated With Surrogate Modelling: Application on Industrial Case Studies

Run-Zi Wang, Ken Suzuki, Hideo Miura, Xian-Cheng Zhang, Shan-Tung Tu

Paper No: IMECE2022-94273

DOI: https://doi.org/10.1115/IMECE2022-94273

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Topics: Creep, Event history analysis, Fatigue, Metamodeling

Proceedings Papers

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Anthony J. Rafanelli

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 207-217, November 16–21, 1997

Paper No: IMECE1997-0820

DOI: https://doi.org/10.1115/IMECE1997-0820

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Topics: Epoxy adhesives, Epoxy resins, Fracture toughness, Reliability, Solders, Adhesives, Bonding, Creep, Fatigue, Fracture (Materials)

Proceedings Papers

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

D. R. Liu

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 249-259, November 16–21, 1997

Paper No: IMECE1997-0824

DOI: https://doi.org/10.1115/IMECE1997-0824

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Topics: Creep, Fatigue, Fracture (Materials), Fracture (Process), Solder joints, Temperature, Printed circuit boards, Damage, Melting, Separation (Technology)

Proceedings Papers

Thermal Mechanical Properties of Two Solder Alloys

Wei Ren, Zhengfang Qian, Minfu Lu, Sheng Liu, Dongkai Shangguan

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 125-130, November 16–21, 1997

Paper No: IMECE1997-1237

DOI: https://doi.org/10.1115/IMECE1997-1237

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Topics: Alloys, Mechanical properties, Solders, Fatigue, Lead-free solders, Computers, Creep, Electronic packaging, Strips, Testing

Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997

Paper No: IMECE1997-1227

DOI: https://doi.org/10.1115/IMECE1997-1227

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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation

Proceedings Papers

Dynamic and Transient Nonlinear Behavior of Articular Cartilage in Unconfined Compression

M. Fortin, J. Soulhat, A. Shirazi-Adl, E. B. Hunziker, M. D. Buschmann

Proc. ASME. IMECE97, Advances in Bioengineering, 199-200, November 16–21, 1997

Paper No: IMECE1997-0297

DOI: https://doi.org/10.1115/IMECE1997-0297

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Topics: Cartilage, Compression, Transients (Dynamics), Stress, Biological tissues, Displacement, Testing, Compressive stress, Creep, Equilibrium (Physics)

Proceedings Papers

Finite Element Modeling of Scleral Creep and Ocular Elongation in Deprivation-Induced Myopia

Jerry D. Grissom, John T. Siegwart, Jr., Alan W. Eberhardt

Proc. ASME. IMECE97, Advances in Bioengineering, 123-124, November 16–21, 1997

Paper No: IMECE1997-0259

DOI: https://doi.org/10.1115/IMECE1997-0259

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Topics: Creep, Elongation, Finite element analysis, Modeling, Feedback

Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

Proceedings Papers

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

Sam Y. Zamrik, Mark L. Renauld

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 333-345, November 16–21, 1997

Paper No: IMECE1997-0549

DOI: https://doi.org/10.1115/IMECE1997-0549

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Topics: Fatigue life, Gas turbines, Thermomechanics, Cycles, Temperature, Creep, Fatigue, Nickel, Superalloys

Proceedings Papers

Effect of Suspension Nonlinearities on Rail Vehicle Bifurcation and Stability

Mehdi Ahmadian, Shaopu Yang

Proc. ASME. IMECE97, Rail Transportation, 97-106, November 16–21, 1997

Paper No: IMECE1997-0598

DOI: https://doi.org/10.1115/IMECE1997-0598

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Topics: Bifurcation, Rail vehicles, Stability, Damping, Creep, Trucks, Yaw, Dynamics (Mechanics), Rails, Simulation results

Proceedings Papers

Effect of Creep Feed Grinding Parameters on Strength and Finish of Alumina

G. Sathyanarayanan, Louis J. Plebani, Hsueh-Ming S. Wang

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 411-415, November 16–21, 1997

Paper No: IMECE1997-0694

DOI: https://doi.org/10.1115/IMECE1997-0694

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Topics: Creep, Finishes, Grinding, Bending strength, Stress, Ceramics, Design, Fracture (Materials), Reliability, Surface roughness

Proceedings Papers

A Damage Mechanics Based Approach to Durability Assessment of Composite Materials

Ramesh Talreja

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 151-156, November 16–21, 1997

Paper No: IMECE1997-0659

DOI: https://doi.org/10.1115/IMECE1997-0659

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Topics: Composite materials, Damage mechanics, Durability, Creep, Damage, Fatigue life, Geometry, Metals, Testing

Proceedings Papers

Densification in Heterogeneous Powder Mixtures by Creep

Antonios Zavaliangos

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 25-36, November 16–21, 1997

Paper No: IMECE1997-0648

DOI: https://doi.org/10.1115/IMECE1997-0648

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Topics: Creep, External pressure, Powder metallurgy, Pressure

2 3 4 5

NARROW

Overview of the Base Model for the Parametric Sensitivity Studies Specific to Performance Assessments of U-Mo Fuel Plates

Molecular Dynamics Analysis on the Degradation Mechanism of the Crystallinity and Strength of Grain Boundaries in Heat-Resistant Alloys Under Creep-Fatigue Loading at Elevated Temperature

Acceleration of Intergranular Cracking in Ni-Base Alloy GH4169 (IN718) Due to the Growth of δ-Phase Around Grain Boundaries Under Creep Loading at Elevated Temperatures

Effect of Strain Rate on the Creep-Fatigue Damage of Polycrystalline Ni-Base Superalloy at Elevated Temperature

Numerical Simulation of Aged Reinforced Concrete Column Nonlinear Creep due to High Sustained Load

Prediction of the Generation of Intergranular Cracking in Stainless Steels Under Creep Loading at Elevated Temperatures

Unified Constitutive Modeling of Haynes 230 for Thermomechanical Fatigue-Creep and Creep Behavior

Creep-Fatigue Reliability Analysis Integrated With Surrogate Modelling: Application on Industrial Case Studies

A Mechanical Reliability Evaluation of Several Electrically Conductive Epoxies: Part III — Fracture Properties

Experimental Observation of Fatigue-Creep Fracture Development in Solder Joints of Different Standoffs

Thermal Mechanical Properties of Two Solder Alloys

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Dynamic and Transient Nonlinear Behavior of Articular Cartilage in Unconfined Compression

Finite Element Modeling of Scleral Creep and Ocular Elongation in Deprivation-Induced Myopia

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

The Effect of Thermomechanical Strain Cycling on the Fatigue Life of Gas Turbine Material In-738LC: A Life Prediction Model

Effect of Suspension Nonlinearities on Rail Vehicle Bifurcation and Stability

Effect of Creep Feed Grinding Parameters on Strength and Finish of Alumina

A Damage Mechanics Based Approach to Durability Assessment of Composite Materials

Densification in Heterogeneous Powder Mixtures by Creep

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